Insulating Coating Film for Conductive Adhesive Heat Protection
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Solution Overview
Problem
Existing electronic component modules face challenges in achieving sufficient heat insulation and preventing short-circuits due to whisker growth in lead-free solder, particularly in downsized circuits, and the use of hollow particles does not adequately enhance heat insulating properties.
Innovation Solution
A coating agent comprising a thermoplastic resin, solvent, and hollow particles is used to form a coating film that covers the conductive adhesive portion in electronic component modules, with specific ratios of resin and particles to enhance heat insulation and uniformity, preventing remelting and thermal deterioration during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hollow particles are used to prevent short-circuits in lead-free solder, then reliability is improved, but heat insulating properties are insufficient
Solution Approach 1:
The patent combines hollow particles with thermoplastic resin to create a composite coating material. The hollow particles (glass beads or ceramic particles) provide reliability by preventing short-circuits, while the thermoplastic resin matrix provides heat insulating properties. This composite structure allows both functions to work synergistically, resolving the contradiction between reliability and heat insulation.
Solution Approach 2:
The patent optimizes the content ratio of hollow particles to thermoplastic resin within specific ranges (hollow particles: 15-50 parts by weight per 100 parts total, thermoplastic resin: 1.0-22.0 wt%). By adjusting these parameters, the coating achieves both sufficient reliability for preventing short-circuits and adequate heat insulating properties, transforming the trade-off into an optimized balance.
2Ease of manufacture
If thermoplastic resin content is increased to improve coating film formation, then ease of manufacture is improved, but heat insulating properties deteriorate
Solution Approach 1:
The patent establishes an optimal range for thermoplastic resin content (1.0-22.0 wt% based on total content of thermoplastic resin and solvent) and hollow particle content (15-50 parts by weight per 100 parts total). Within these parameter ranges, the coating maintains good formability while achieving sufficient heat insulating properties, resolving the contradiction between ease of manufacture and heat insulation.
Solution Approach 2:
The hollow particles create a porous structure within the coating film that enhances heat insulation without requiring high thermoplastic resin content. The air pockets within the hollow particles provide thermal insulation, allowing the coating to achieve good heat insulating properties even with lower thermoplastic resin content, thus maintaining ease of manufacture.
3Temperature
If hollow particle content is increased to enhance heat insulation, then heat insulating properties are improved, but manufacturing precision deteriorates due to poor dispersibility
Solution Approach 1:
The patent specifies that hollow particle content should be 15-50 parts by weight per 100 parts total content of thermoplastic resin and solvent. This parameter optimization ensures sufficient heat insulating properties while maintaining good dispersibility and uniform distribution in the coating film, preventing aggregation and maintaining manufacturing precision.
Solution Approach 2:
The patent ensures uniform distribution of hollow particles throughout the coating film, creating consistent local properties across the entire coating. This uniform distribution prevents localized aggregation that would compromise manufacturing precision while maintaining overall heat insulating properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coating agent forms a coating film with high heat insulating properties, uniformly distributed hollow particles, and suppresses remelting of conductive adhesive portions and thermal deterioration of circuit boards during injection molding, ensuring reliable module integrity.
Implementation Method 1
a solvent that dissolves the thermoplastic resin
Implementation Method 2
hollow particles, in which a content of the thermoplastic resin is 1.0 wt % or more and 22.0 wt % or less based on 100 wt % of a total content of the thermoplastic resin and the solvent, and a content of the hollow particles is 15.0 parts by weight or more and 50.0 parts by weight or less based on 100 parts by weight of the total content of the thermoplastic resin and the solvent
Implementation Method 3
forming a coating film having high heat insulating properties
Data Source
AI summary
Provided is a coating agent capable of forming a coating film having high heat insulating properties. The coating agent according to the present invention is a coating agent used for forming a coating film in an electronic component module in which an electronic component is mounted on a circuit board via a conductive adhesive portion, the conductive adhesive portion being coated with a coating film, the coating agent includes a thermoplastic resin, a solvent that dissolves the thermoplastic resin, and hollow particles, in which a content of the thermoplastic resin is 1.0 wt % or more and 22.0 wt % or less based on 100 wt % of a total content of the thermoplastic resin and the solvent, and a content of the hollow particles is 15.0 parts by weight or more and 50.0 parts by weight or less based on 100 parts by weight of the total content of the thermoplastic resin and the solvent.