Insulating Heat-Radiating Coating Composition with Silicon Carbide Fillers

The patent changes the physical and chemical parameters of the filler by using silicon oxide particles with specific characteristics (average particle diameter of 0.5 to 5 μm, specific surface area of 1 to 50 m²/g) and controlling the filler content within 1-50 wt%. This parameter optimization enables the filler to provide thermal conductivity while maintaining electrical insulation, resolving the contradiction between heat-radiating performance and electrical insulating property.

The patent creates a composite coating material combining resin (main component) with silicon oxide filler (1-50 wt%). This composite structure allows the resin matrix to provide electrical insulation while the silicon oxide particles provide thermal conductivity pathways. The synergistic combination resolves the contradiction by integrating both thermal and electrical properties in a single material system.

The patent optimizes the particle size parameters of the filler, specifying an average particle diameter of 0.5 to 5 μm. This controlled particle size range ensures that fillers are small enough to maintain surface smoothness and uniformity while being large enough to provide effective thermal conductivity networks. The specific surface area control (1 to 50 m²/g) further refines this balance, preventing excessive filler aggregation that would degrade surface quality.

The patent ensures uniform distribution of filler particles throughout the coating layer, creating consistent local properties. By controlling filler content (1-50 wt%) and particle characteristics, the coating achieves homogeneous heat-radiating performance across the entire surface without local clustering that would cause surface defects or uneven thermal properties.

The patent develops a composite system where resin forms the continuous matrix providing adhesion and mechanical strength, while silicon oxide filler (1-50 wt%) is dispersed within this matrix to provide thermal conductivity. The resin-filler composite structure ensures that the bonding properties come from the resin phase while thermal performance comes from the filler phase, resolving the contradiction between heat-radiating performance and adhesive strength.

The patent controls the filler content parameter within 1-50 wt% to prevent excessive filler aggregation that would compromise adhesion. This parameter control ensures sufficient filler for thermal performance while maintaining enough resin content to provide adequate adhesive strength and durability against physical and chemical stimuli.