Insulating Liquid Die-Bonding Agent for Semiconductor Devices
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Solution Overview
Problem
Existing insulating liquid die-bonding agents for semiconductor chips can damage the active surface during heat cycles, lead to void formation, and compromise wire-bonding reliability, especially when used in face-down-type semiconductor devices.
Innovation Solution
A die-bonding agent comprising a mixture of organopolysiloxane resin, linear-chain organopolysiloxane, silicon-bonded hydrogen atoms, insulating spherical silicone rubber particles, and a hydrosilylation catalyst, optimized for screen printing and void resistance, ensuring the semiconductor chip's integrity and wire-bonding capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a relatively hard filler is used in the insulating liquid die-bonding agent to provide insulation conditions and prevent loss of wire bondability, then insulation performance and wire bondability are improved, but the active surface of the semiconductor chip may be damaged during heat cycles
Solution Approach 1:
The patent changes the key parameter of filler hardness by replacing hard inorganic insulating bodies with soft spherical silicone rubber particles. This parameter change allows the die-bonding agent to maintain insulation performance while eliminating damage to the semiconductor chip's active surface during heat cycles
Solution Approach 2:
The patent creates a composite material system combining silicone rubber base resin with spherical silicone rubber particles and insulating grains. This composite structure provides both the softness needed to protect the active surface and the insulating properties required for reliable wire bonding
2Object-affected harmful factors
If spherical silicone rubber particles are used in the die-bonding agent to improve flexibility and reduce damage, then protection of the active surface is improved, but the composition flows to peripheral areas during screen printing causing contamination
Solution Approach 1:
The patent applies local quality by creating thixotropic behavior in the die-bonding agent, where the viscosity changes locally based on applied stress. During screen printing, the agent remains stable and does not flow to peripheral areas. During bonding, it becomes more fluid to fill gaps and then stabilizes, preventing contamination while maintaining protection properties
Solution Approach 2:
The patent introduces dynamic viscosity characteristics through thixotropy, allowing the die-bonding agent to adapt its flow properties during different process stages. The agent transitions from a stable, non-flowing state during screen printing to a more fluid state during bonding, then stabilizes again, preventing both contamination and void formation
3Object-affected harmful factors
If the die-bonding agent is made softer to prevent active surface damage, then protection of the semiconductor chip is improved, but voids may form on the interface between the chip and die-bonding agent
Solution Approach 1:
The patent uses a composite material system combining silicone rubber base resin with spherical silicone rubber particles and insulating grains. This composite structure provides both the softness needed to protect the active surface and sufficient bonding strength to prevent void formation, as the insulating grains provide structural support while the silicone rubber matrix ensures flexibility
Solution Approach 2:
The patent optimizes multiple parameters including particle size distribution (0.1-10 μm spherical silicone rubber particles), filler content (5-50 mass%), and viscosity (100-10000 cP) to achieve the right balance between softness for protection and bonding strength to prevent voids
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents active surface damage, reduces void formation, and maintains wire-bonding reliability, resulting in a highly reliable semiconductor device.
Implementation Method 1
an organopolysiloxane resin composed of siloxane units of formula R1...(a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups... (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms... (E) a complex of platinum with 1,3-divinyltetramethyldisiloxane
Data Source
Figure 1
AI summary
An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 µm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.