Insulating Frame Semiconductor Package Thermal Stress
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Solution Overview
Problem
The increasing number of pads in semiconductor chips leads to reduced spacing between external connection terminals, causing interference issues, and the use of metal frames in semiconductor packages results in thermal stress due to differences in thermal expansion coefficients, leading to deformation and potential damage during the molding process.
Innovation Solution
A semiconductor package using an insulating frame with a through hole and a redistribution layer, where the frame's surface and inner circumferential surface are designed to distribute thermal stress evenly, and a conductive layer is added for electromagnetic shielding, along with a polymer bonding layer for improved manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal frame is used to accommodate the semiconductor chip and EMC, then the structural strength is improved, but thermal stress occurs due to the difference in thermal expansion coefficients between the metal frame and the semiconductor chip, causing deformation and potential damage
Solution Approach 1:
The patent uses a composite structure consisting of a metal frame and an insulating frame. The metal frame provides structural strength, while the insulating frame (made of ceramic or glass) accommodates the semiconductor chip and EMC, minimizing thermal stress due to its thermal expansion properties. This composite approach allows both strength and thermal stress resistance to be achieved simultaneously.
2Adaptability or versatility
If the number of pads is increased to integrate various functions, then the functionality is improved, but the spacing distance between pads is reduced, causing interference problems between signals
Solution Approach 1:
The patent employs a fan-out type package structure where external connection terminals are formed outside the semiconductor chip area by extending wiring layers through the molding material. This dimensional extension allows multiple pads to be spaced apart in the planar direction, eliminating signal interference while maintaining high functionality through increased pad count.
3Object-affected harmful factors
If a metal shielding layer is used to cover the wiring layer, then electromagnetic shielding is improved, but electrical short-circuiting may occur between the shielding layer and the wiring layer
Solution Approach 1:
The patent introduces an insulating frame made of ceramic or glass as an intermediary between the metal shielding layer and the wiring layer. This insulating frame prevents direct contact between the metal shielding layer and the wiring layer, eliminating the risk of electrical short-circuiting while maintaining electromagnetic shielding effectiveness through the metal layer.
4Weight of moving object
If aluminum frame is used due to its light weight, then the weight is reduced, but the high thermal expansion coefficient causes thermal stress and mis-arrangement of semiconductor chips during molding
Solution Approach 1:
The patent combines a metal frame (providing light weight) with an insulating frame made of ceramic or glass (providing low thermal expansion). The insulating frame accommodates the semiconductor chip and EMC, minimizing thermal stress during molding while the metal frame maintains overall structural integrity and light weight. This composite structure resolves both weight and manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The insulating frame minimizes mechanical stress and thermal deformation, prevents short circuits, and enhances electromagnetic shielding, while the conductive layer facilitates heat dissipation and reduces manufacturing complexity.
Implementation Method 1
the frame's surface and inner circumferential surface are designed to distribute thermal stress evenly
Implementation Method 2
the conductive layer facilitates heat dissipation
Implementation Method 3
a conductive layer is added for electromagnetic shielding
Data Source
AI summary
A semiconductor package using an insulating frame of various is disclosed. The insulating frame has a through hole therein, and the semiconductor chip is mounted in the through hole. Further, a via hole is provided in the periphery of the through hole, and a via contact filling the via hole is provided. Whereby the pad of the semiconductor chip is electrically connected to the via contact through the distribution layer. Further, an adhesive buffer layer for increasing the adhesive force is introduced into the upper portion of the insulating frame.