Insulating Heat Dissipation Structure for Miniaturized Electronics
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Solution Overview
Problem
Conventional heat sinks in electronic devices are complex and voluminous, hindering the miniaturization of electronic devices due to their large size and space occupancy.
Innovation Solution
A heat dissipation structure comprising a channel structure made of electrical insulating material with an evaporation and condenser portion, utilizing a low-boiling-point cooling material that absorbs heat, evaporates, and dissipates it to the external environment through channels, allowing for efficient thermal performance without increasing the device's volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are used for dissipating heat, then heat dissipation function is achieved, but device volume increases and miniaturization is impeded
Solution Approach 1:
The patent employs phase change material (paraffin wax) that undergoes phase transition from solid to liquid to absorb and store heat energy. The phase change process occurs within the heat dissipation structure itself, allowing efficient thermal management without requiring large external heat sinks, thus reducing overall device volume while maintaining effective heat dissipation
Solution Approach 2:
The heat dissipation structure is nested within the battery assembly, with the phase change material contained inside the battery housing. The heat dissipation channels are integrated into the battery structure, allowing the heat dissipation function to be embedded within the existing device architecture rather than adding external components, thereby minimizing volume increase
2Temperature
If conventional heat sinks are used, then heat dissipation is achieved, but structural complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated structure: the battery housing serves as both the containment structure and the heat dissipation channel carrier. The heat dissipation channels are formed directly within the battery housing structure, merging the structural support function with the thermal management function, thereby simplifying the overall design and reducing structural complexity
Solution Approach 2:
The battery housing is designed to serve multiple purposes: it provides mechanical protection for the battery elements, contains the phase change material, and acts as the heat dissipation channel structure. This multi-functional design eliminates the need for separate heat sink components and reduces the number of parts, simplifying the overall device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat dissipation while minimizing the device's size by exposing the condenser portion to the external environment, thus reducing the overall volume of the electronic device without affecting its functionality.
Implementation Method 1
The cooling material 20 in the evaporation portion 11 absorbs the heat from the heat source to evaporate to become gaseous
Implementation Method 2
the cooling material 20 in the evaporation portion 11 absorbs the heat from the heat source to evaporate to become gaseous, and the cooling materials 20 in gas form flows to the condenser portion 12
Implementation Method 3
The cooling material 20 in the condenser portion 12 dissipates heat to an external environment to condense to become liquid
Data Source
AI summary
A heat dissipation structure comprises a channel structure and a cooling material received and sealed in the channel structure. The cooling material is a low-boiling-point electrical insulating fluid. The channel structure is made of an electrical insulating material. The channel structure comprises an evaporation portion, a condenser portion, and at least one channel connecting the evaporation portion and the condenser portion. An electronic device using the heat dissipation structure is also provided.