Thermally Conductive Electrically Insulating Heat Sink Component
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Solution Overview
Problem
Electrical circuits, such as power amplifier circuits, generate heat that can lead to overheating if not adequately managed, potentially causing damage to components.
Innovation Solution
A heat sink component made from thermally conductive, electrically non-conductive material with strategically positioned heat source and sink terminals for efficient heat dissipation, suitable for land grid array type mounting, and potentially incorporating thin-film components for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sink component uses thermally conductive material, then heat dissipation efficiency is improved, but electrical conductivity may cause short circuit risks
Solution Approach 1:
The patent changes the material parameters by selecting materials with high thermal conductivity but low electrical conductivity, such as ceramics or metal matrix composites. This allows the heat sink to efficiently conduct heat away from power amplifiers while maintaining electrical insulation to prevent short circuits.
Solution Approach 2:
The patent employs composite materials that combine thermal conductivity with electrical insulation properties. Examples include metal matrix composites or ceramic-matrix composites that integrate heat dissipation pathways while blocking electrical current, thus resolving the contradiction between thermal performance and electrical safety.
2Ease of operation
If heat sink component is designed for land grid array mounting, then ease of assembly is improved, but device complexity increases
Solution Approach 1:
The heat sink component is designed with a standardized land grid array footprint that allows it to be mounted using conventional surface mount technology processes. The component integrates multiple functions including heat dissipation, electrical isolation, and mechanical mounting support, enabling assembly through standard automated pick-and-place equipment without requiring specialized tooling or complex procedures.
3Reliability
If heat sink terminal is spaced apart from side surfaces, then electrical isolation is improved, but thermal transfer efficiency may be reduced
Solution Approach 1:
The patent applies local quality by creating zones of different properties within the heat sink component. The regions near the heat source terminals have optimized thermal conductivity and closer spacing for efficient heat uptake, while the heat sink terminals are spaced farther from side surfaces to provide electrical isolation. This spatial variation in design parameters allows simultaneous optimization of thermal performance and electrical safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat buildup in electrical circuits, preventing overheating and potential damage by facilitating efficient heat transfer and distribution, suitable for applications in power handling systems and monolithic microwave integrated circuits.
Implementation Method 1
a body including a thermally conductive material that is electrically non-conductive
Data Source
AI summary
A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. The body can have a top surface, a bottom surface opposite the top surface, and a plurality of side surfaces. The heat sink component also can include a heat source terminal formed over the bottom surface of the body. The heat source terminal can be spaced apart from the plurality of side surfaces. The heat sink component further can include a heat sink terminal formed over the bottom surface of the body. The heat sink terminal can be spaced apart from the plurality of side surfaces.