Insulating Heat Sink Terminal Layout for Tight Thermal Spacing
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Solution Overview
Problem
Electrical circuits generate heat during operation, leading to potential overheating and damage if not adequately dissipated, necessitating effective heat management solutions.
Innovation Solution
A heat sink component with a thermally conductive, electrically non-conductive body featuring optimized terminal configurations, including heat source and sink terminals, to efficiently dissipate heat through minimized spacing and symmetrical or offset arrangements, enhancing thermal conductivity and connection with heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sink terminals are placed close together to maximize heat transfer area, then heat dissipation efficiency is improved, but electrical insulation between heat source and heat sink terminals deteriorates
Solution Approach 1:
The patent changes the material parameter of the heat sink body from conventional electrically conductive materials to electrically insulating materials with high thermal conductivity. This parameter change allows terminals to be placed in close proximity for efficient heat transfer while maintaining electrical insulation between heat source and heat sink terminals, resolving the contradiction between heat dissipation efficiency and electrical insulation reliability.
2Temperature
If the heat sink body is made electrically conductive for optimal thermal performance, then heat conduction is improved, but electrical isolation between terminals deteriorates
Solution Approach 1:
The patent fundamentally changes the material parameters of the heat sink body, selecting materials that simultaneously exhibit high thermal conductivity and high electrical resistivity. This dual-parameter optimization enables the heat sink to maintain excellent heat conduction properties while providing inherent electrical isolation between terminals, eliminating the need for additional insulating structures.
Solution Approach 2:
The patent employs composite material structures or specially engineered materials that combine properties traditionally found in separate materials - the thermal conductivity of metals with the electrical insulation of ceramics or polymers. This composite approach allows the heat sink body to achieve both optimal heat conduction and electrical isolation simultaneously.
3Temperature
If terminal spacing is minimized to increase heat transfer efficiency, then thermal performance is improved, but manufacturing precision requirements increase
Solution Approach 1:
By changing the material parameters to use electrically insulating materials with high thermal conductivity, the patent enables smaller terminal spacing without compromising electrical isolation. The inherent electrical insulation property of these materials provides a larger process window for manufacturing, reducing the stringency of precision requirements while maintaining optimal thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat sink component effectively manages heat dissipation, preventing overheating and ensuring the longevity of electrical components by maintaining optimal thermal conductivity and connection with heat sinks.
Implementation Method 1
a body comprising a thermally conductive material that is electrically non-conductive
Data Source
AI summary
A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a surface of the body. At least one second terminal can be formed over the surface of the body. A terminal spacing distance can be defined along the surface between the first terminal and the second terminal. A ratio of a length of the surface to the terminal spacing distance can be greater than about 10. Additionally or alternatively, a ratio of the area of the at least one body surface to the total terminal area can be less than 1.2. A component assembly can include a device having a plurality of terminals exposed on a top surface, and the heat source terminal and the heat sink terminal of the heat sink component can be connected with respective terminals of the device.