Insulating Heating Sheet for Chip on Film Package Thermal Management
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Solution Overview
Problem
Conventional chip on film (COF) semiconductor packages face issues with heat management due to inflexible metal-based heating pads, leading to increased production costs and potential lead breakage from thickness-related rigidity, necessitating additional insulation and complex fabrication processes.
Innovation Solution
A chip on film semiconductor package utilizing an insulating heating sheet composed of a compound including silicon rubber, boron nitride, and glass fiber, which provides improved thermal resistance and flexibility, eliminating the need for additional insulation and allowing for efficient heat radiation without the use of metal-based materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal-based heating pad is used to radiate heat from the driver IC chip, then heat radiation performance is improved, but flexibility is degraded and additional insulation is required
Solution Approach 1:
The heating pad uses a composite structure combining metal particles (for thermal conductivity) with polymer matrix material (for flexibility). This allows the heating pad to maintain good heat radiation performance while achieving the flexibility required for COF package applications, resolving the contradiction between thermal performance and flexibility.
Solution Approach 2:
By changing the material composition parameters of the heating pad (incorporating polymer materials alongside metal particles), the invention achieves both adequate thermal conductivity and required flexibility. The polymer content and type can be adjusted to optimize the balance between heat radiation capability and flexibility.
2Temperature
If a metal-based heating pad is used, then heat radiation is improved, but device complexity increases due to additional insulation requirements
Solution Approach 1:
The polymer-based composite heating pad inherently provides electrical insulation while maintaining thermal conductivity through metal particles. This eliminates the need for separate insulation layers, simplifying the fabrication process and reducing device complexity while still achieving effective heat radiation.
Solution Approach 2:
The heating pad material serves multiple functions simultaneously: it provides heat radiation through metal particles, electrical insulation through the polymer matrix, and mechanical flexibility. This multi-functionality eliminates the need for separate insulation components, reducing overall device complexity.
3Temperature
If the heating pad is made thicker to improve heat radiation, then thermal performance is improved, but flexibility is degraded and lead breakage risk increases
Solution Approach 1:
The polymer matrix provides flexibility and mechanical strength even in thicker configurations, while embedded metal particles provide thermal conductivity. This composite structure allows the heating pad to be made thicker for improved heat radiation without sacrificing flexibility, thereby preventing lead breakage that would occur with rigid metal-based pads of similar thickness.
Solution Approach 2:
By changing the material composition to include flexible polymer materials, the heating pad can achieve adequate thickness for heat radiation while maintaining the flexibility needed to prevent lead breakage. The polymer content and distribution can be optimized to balance thermal performance and mechanical flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces production costs, enhances flexibility, and prevents lead breakage by offering superior thermal conductivity and resistance, making the package suitable for various applications with reduced thermal stress and increased design flexibility.
Implementation Method 1
The insulating heating sheet radiates a heat generated by operation of the driver IC chip through the under-fill layer and the leads
Implementation Method 2
The insulating heating sheet radiates a heat generated by operation of the driver IC chip
Implementation Method 3
an insulating heating sheet formed on an opposite side of the film contacting to the plurality of leads, wherein the insulating heating sheet is formed of a compound based a glass fiber
Data Source
AI summary
A chip on film type semiconductor package includes a film, a plurality of leads formed over the film, a chip formed over the plurality of leads, an under-fill layer filled an space between the chip and the plurality of leads and an insulating heating sheet formed on an opposite side of the film contacting to the plurality of leads, wherein the insulating heating sheet is formed of a compound based on a glass fiber.