Insulating Layer Crack Stopper Structure for Stress Absorption
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Solution Overview
Problem
Electronic devices are prone to cracking and damage due to stress from external forces, which can affect their performance, as existing structures are inadequate in stress modulation.
Innovation Solution
A crack stopper structure is implemented in electronic devices, featuring recesses and non-recesses in an insulating layer with a stress-absorbing organic material, reducing the likelihood of cracking by absorbing stress energy and distributing it across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional substrate structure is used, then the device is simple to manufacture, but the substrate is prone to cracking under stress
Solution Approach 1:
The substrate is divided into multiple segments by introducing recesses that extend from the rear surface toward the front surface. These recesses create discrete segments separated by stress-absorbing regions, preventing crack propagation across the entire substrate while maintaining overall structural integrity.
Solution Approach 2:
Stress-absorbing material is introduced as an intermediary substance within the recesses. This material acts as a mediator that absorbs and distributes mechanical stress, preventing direct stress transfer between substrate segments and reducing the likelihood of cracking.
2Strength
If the substrate edges are reinforced, then the crack resistance is improved, but the stress transfer to active area increases
Solution Approach 1:
The substrate structure is made non-uniform by creating localized recesses at specific positions, particularly near edges and corners. This local modification provides enhanced stress management at vulnerable locations without affecting the overall substrate properties or active area performance.
Solution Approach 2:
The recesses intentionally create localized weak points or stress-absorbing zones that convert harmful stress concentrations into beneficial stress-dissipating features. By allowing controlled stress absorption in non-active regions, the overall reliability of the active area is improved.
3Reliability
If a crack stopper structure with recesses is added, then the stress absorption is improved, but the manufacturing complexity increases
Solution Approach 1:
The recesses are formed in the substrate before final assembly and testing. This preliminary structuring allows the stress-absorbing features to be built-in during manufacturing, eliminating the need for post-processing modifications and simplifying the overall manufacturing workflow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The crack stopper structure effectively reduces the stress transferred to the active area of electronic devices, minimizing the risk of cracking and enhancing their durability under external forces.
Implementation Method 1
reducing the likelihood of cracking by absorbing stress energy and distributing it across the substrate
Data Source
AI summary
An electronic device is provided. The electronic device includes at least two non-recesses, a recess and an organic layer. The recess is disposed between the at least two non-recesses. The at least two non-recesses and the recess are formed in an insulating layer. The organic layer is disposed on the at least two non-recesses and in the recess. The organic layer includes an end which is in contact with one of the at least two non-recesses.