Insulating Liquid Cooling for High-Power Devices
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Solution Overview
Problem
High-power devices face challenges in heat dissipation due to indirect coolant contact, high thermal resistance, and increased power consumption from forced convection methods, leading to potential damage and safety hazards from uneven heat accumulation.
Innovation Solution
A coolant contact type cooling system utilizing a sealed case body with insulating liquid heat-conductive coolant, nozzles, and a secondary heat-superconductive coolant for direct heat transfer, eliminating intermediates and reducing thermal resistance, with a spray structure that enhances heat exchange efficiency and relies on gravity for coolant circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If indirect coolant contact with heat sink member is used for insulation protection, then electrical insulation is improved, but thermal resistance increases and heat dissipation efficiency deteriorates
Solution Approach 1:
The patent introduces an insulating liquid coolant as an intermediary substance that provides both electrical insulation and thermal conduction. The coolant flows through channels in direct contact with the heat sink member, eliminating the need for solid thermal interface materials while maintaining electrical isolation between the coolant and conductive components through proper channel design and material selection.
Solution Approach 2:
The patent changes the physical state and properties of the cooling medium from gas (air) to liquid (insulating liquid coolant). This parameter change enables direct liquid-to-solid heat transfer contact, dramatically improving thermal conductivity while the insulating properties of the liquid maintain electrical safety. The liquid coolant's dual properties of electrical insulation and thermal conduction resolve the contradiction between insulation and heat dissipation.
2Temperature
If forced air convection cooling is used, then heat dissipation is achieved, but power consumption increases due to fan requirements
Solution Approach 1:
The patent transitions from pneumatic cooling (air convection) to hydraulic cooling (liquid circulation). The liquid coolant system uses a pump to circulate the coolant through channels, providing more efficient heat transfer per unit of energy consumed. The liquid's higher specific heat capacity and thermal conductivity enable effective heat removal with lower power input compared to high-velocity air convection systems.
Solution Approach 2:
The patent changes the cooling medium from air to insulating liquid, fundamentally altering the heat transfer mechanism from convection-dominated to conduction-dominated heat transfer. This parameter change increases the heat transfer coefficient by an order of magnitude, allowing for reduced fan/pump power requirements while achieving superior heat dissipation performance.
3Temperature
If forced convection circulation of air is used, then heat dissipation is improved, but air cleanliness requirements increase and system complexity increases
Solution Approach 1:
The patent replaces the forced air convection system with a closed-loop liquid coolant circulation system. The liquid coolant is contained within sealed channels, eliminating the need for air filtration, clean room environments, and complex air flow control mechanisms. The hydraulic system provides inherent containment and simplifies the overall system architecture while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces thermal resistance, increases heat transfer efficiency, and eliminates the need for additional power consumption, enhancing the service life and reliability of high-power devices while simplifying the cooling system architecture and reducing costs.
Implementation Method 1
The nozzle sprays against the front and back surfaces of the high-power device to form a relatively open spray structure. The insulating liquid heat-conductive coolant directly contacts the heat-generating surface of the high-power device that needs to dissipate heat, which reduces the contact thermal resistance.
Implementation Method 2
The coolant pump sinks in the insulating liquid heat-conductive coolant, the filter is installed at an inlet of the coolant pump, the coolant pump is connected to the spray main pipe
Implementation Method 3
The sealed case body is a structure having inner and outer layers, a chamber between the inner and outer layers is filled with a heat-superconductive coolant, and an outer wall of the outer layer of the sealed case body is provided with heat dissipating fins.
Implementation Method 4
an outer wall of the outer layer of the sealed case body is provided with heat dissipating fins
Implementation Method 5
an outer wall of the outer layer of the sealed case body is provided with heat dissipating fins
Data Source
Figure 1
AI summary
Disclosed is a working contact cooling system for a high-power device (1), wherein the sealed case body (8) is a structure having inner and outer layers, a chamber between the inner and outer layers is filled with a heat-superconductive coolant (9), and an outer wall of the outer layer of the sealed case body (8) is provided with heat dissipating fins (10); the sealed case body (8) is provided with an insulating liquid heat-conductive coolant (2), the coolant pump (6) sinks in the insulating liquid heat-conductive coolant (2), the filter (7) is installed at an inlet of the coolant pump (6), the coolant pump (6) is connected to the spray main pipe (5), and a plurality of spray branch pipes (4) are connected in parallel with the spray main pipe (5), each of the spray branch pipes (4) is provided with a plurality of nozzles (3), and the nozzles (3) face the high-power device (1); the nozzles (3) spray against front and back surfaces of the high-power device (1) to form a relatively open spray structure; the insulating liquid heat-conductive coolant (2) is a non-polar substance, and the insulating liquid heat-conductive coolant (2) has no phase change during the spraying process. The present invention has reasonable heat dissipation structure and effective heat dissipation.