Insulating Liquid Cooling Layout for Uniform High-Voltage Semiconductors
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Solution Overview
Problem
High power, high voltage pulsed power supplies for plasma processing face challenges due to limited space, high insulation requirements, and unpredictable failures from direct contact cooling with insulating liquids, which affect voltage and current rise slope and lead to electrical deviations.
Innovation Solution
An electronic device with a container filled with an electrically insulating heat transfer liquid that guides the liquid in parallel across semiconductor components to maintain uniform temperature, using a liquid guiding equipment and degassing units to prevent bubble formation and enhance insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If direct contact cooling with insulating liquids is used, then heat transfer efficiency is improved, but unpredictable failures occur due to bubble formation and insulation degradation
Solution Approach 1:
A hydrophobic coating is applied to the electrical components, creating an intermediary layer between the insulating liquid and the component surfaces. This coating prevents bubble adhesion and maintains electrical insulation while allowing efficient heat transfer, thereby eliminating unpredictable failures without compromising cooling performance
Solution Approach 2:
The surface properties of electrical components are modified by applying a hydrophobic coating, changing the surface energy characteristics. This parameter change prevents liquid wetting and bubble formation on component surfaces, resolving the reliability issue while maintaining the temperature control function
2Volume of moving object
If electronic components are packed close together to reduce dimensions, then space utilization is improved, but insulation requirements cannot be met due to high voltages
Solution Approach 1:
The hydrophobic coating acts as an intermediary that enhances electrical insulation between closely packed components while maintaining compact dimensions. The coating creates a reliable insulation barrier that allows reduced creepage and discharge distances, enabling compact design without compromising insulation strength
Solution Approach 2:
The hydrophobic coating is applied locally to the surfaces of electrical components, providing enhanced insulation properties exactly where needed at component interfaces. This localized treatment allows close packing while maintaining adequate insulation, as the coating creates reliable insulation barriers at critical locations
3Temperature
If insulating liquid is used for cooling, then heat transfer is improved, but temperature differences among components cause electrical deviations
Solution Approach 1:
The hydrophobic coating serves as a mediator that ensures uniform heat transfer characteristics across all components by preventing variable bubble adhesion. This creates consistent thermal contact between the insulating liquid and all component surfaces, eliminating temperature differences and resulting electrical deviations
Solution Approach 2:
The hydrophobic coating is applied uniformly to all electrical components, creating homogeneous surface properties throughout the system. This homogeneity ensures consistent heat transfer and temperature distribution across all components, preventing the temperature variations that cause electrical deviations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution stabilizes the electronic device by reducing temperature differences among components, enhancing electrical insulation, and preventing unpredictable failures, ensuring reliable operation of the pulsed power supply.
Implementation Method 1
an electrically insulating heat transfer liquid, filled within the container and having direct contact to the plurality of electrical components and configured to transport heat away from the plurality of electrical components
Implementation Method 2
a liquid guiding equipment configured to guide the electrically insulating heat transfer liquid along at least a part of the plurality of electrical components such that the part of the plurality of electrical components are cooled with the same temperature
Data Source
AI summary
An electronic device for a high power, high voltage pulsed power supply, including electrical components configured to generate heat, a container, at least a part of the plurality of electrical components being placed in the container, and a liquid, filled within the container and having direct contact to the electrical components and configured to transport heat from the electrical components. The electronic device includes guiding equipment configured to guide the liquid along at least a part of the electrical components such that the electrical components are cooled with the same temperature. The electrical components include transistors and/or diodes connected in a series circuit, the series circuit configured to be connected to a high voltage greater than or equal to 1 kV. The transistors and/or diodes are connected such that, in operation, the high voltage is divided between at least a part of the transistors and/or diodes.