Multi-Layer Insulating Package Structure for Thermal Management
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Solution Overview
Problem
The semiconductor industry faces challenges in reducing the size of substrate packages while maintaining efficient heat dissipation, as existing package structures struggle to effectively manage heat generated by increasingly complex and compact IC devices, which can lead to reduced efficiency and potential device damage.
Innovation Solution
A package structure is designed with a layered configuration, including a first insulating layer of ceramic material with high heat conductivity and hardness, a second insulating layer of resin with lower heat conductivity and hardness, and a third insulating layer that may include a metal layer and insulating film, along with a resilient layer, to enhance heat dissipation and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a compact package structure is used to reduce substrate size, then the area occupied by the package is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The package structure is divided into multiple functional layers including a first insulating layer with high heat conductivity for heat dissipation, a second insulating layer with low heat conductivity for electrical isolation, and a third insulating layer for protection. This segmentation allows each layer to perform its specific function optimally while maintaining compact overall dimensions.
Solution Approach 2:
The patent employs composite material structures where the first insulating layer uses materials with high heat conductivity (such as ceramic or metal-filled resin) to efficiently conduct heat away from the chip, while the second insulating layer uses materials with low heat conductivity (such as epoxy resin or polyimide) for electrical isolation. This composite approach resolves the contradiction by allowing heat to be efficiently managed in specific regions while maintaining electrical isolation in other regions, all within a compact package footprint.
2Temperature
If high heat conductivity material is used in the first insulating layer, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent adjusts the heat conductivity parameter of the first insulating layer by selecting materials with appropriate thermal properties (such as ceramic with high heat conductivity or resin with modified fillers) to achieve effective heat dissipation. This parameter optimization allows the structure to meet thermal management requirements while maintaining compatibility with existing manufacturing processes, thus resolving the contradiction between heat dissipation performance and manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency, prevents temperature buildup, and increases the structural reliability of the package, allowing for both miniaturization and effective heat management, thus enhancing the performance and durability of IC devices.
Implementation Method 1
the heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer
Implementation Method 2
the heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer
Data Source
AI summary
A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.