Insulating Paste Electrode Coating for Multi-Electrode Conductivity
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Solution Overview
Problem
Existing insulating paste conductive technologies face challenges in achieving effective conductivity with multiple electrodes or electrode pairs, as the number of electrodes negatively impacts conductivity, and existing solutions only address two pairs of electrodes, leaving technical obstacles unaddressed.
Innovation Solution
An insulating paste-based conductive device comprising a first and second substrate with electrodes and a thermosetting insulating paste coating that provides electrical, light, and heat conduction, manufactured through sizing, pressure application, and heating to form a nanometer-thick coating for electrical connection between electrodes, suitable for various circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of electrodes or electrode pairs is increased, then the conductivity of the electrode decreases
Solution Approach 1:
The conductive adhesive is divided into multiple independent conductive channels, each connecting a pair of electrodes. This segmentation allows each channel to maintain optimal conductivity while supporting a larger total number of electrodes through parallel conduction paths.
Solution Approach 2:
Multiple conductive functions are merged into a single conductive adhesive layer that simultaneously connects multiple electrode pairs. The adhesive integrates electrical conduction, mechanical bonding, and insulation functions, enabling it to handle numerous electrodes without requiring separate connection mechanisms for each pair.
2Reliability
If existing insulating paste conductive technology is used for two pairs of electrodes, then conductivity is achieved, but the solution does not scale to more electrodes
Solution Approach 1:
The conductive adhesive is designed with universal applicability to connect any number of electrode pairs while maintaining consistent conductivity performance. The material composition and structure are optimized to provide uniform electrical properties across multiple connection points, making it adaptable from two pairs to numerous electrodes without requiring formulation changes.
Solution Approach 2:
The solution transitions from addressing only two electrode pairs to handling multiple electrodes by introducing a multi-dimensional conductive network within the adhesive layer. This network distributes electrical pathways across the entire adhesive area, enabling scalable electrode connections in both quantity and spatial arrangement.
3Reliability
If insulating paste coating is applied between electrodes, then electrical connection is achieved, but oxidation and corrosion of electrodes occur
Solution Approach 1:
The conductive adhesive serves as an intermediary substance between electrodes, providing both electrical conduction and protective functions. It forms a barrier layer that prevents direct exposure of electrodes to oxidizing environments while maintaining electrical continuity through its conductive properties, thus eliminating the trade-off between connection and protection.
Solution Approach 2:
The conductive adhesive is formulated as a composite material combining conductive fillers (such as metal particles or carbon) within an insulating polymer matrix. This composite structure provides simultaneous electrical conductivity and corrosion resistance, as the polymer matrix protects the conductive phase and electrodes from oxidation while the conductive fillers maintain electrical pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves integrated electric, light, and heat conduction, protecting electrodes from oxidation and corrosion, and is applicable to diverse circuit boards, including ceramic, metal-based, and transparent types, enhancing conductivity and universality.
Implementation Method 1
heating and curing the first substrate and the second substrate to form the insulating paste coating on the contact surface between the first electrode and the second electrode
Implementation Method 2
protecting electrodes from oxidation and corrosion
Implementation Method 3
integrated electric conduction, light conduction and heat conduction performances
Data Source
AI summary
Provided are an insulating paste-based conductive device and a manufacturing method thereof. The device comprises a first substrate and a second substrate arranged relative to the first substrate, and further comprises at least one first electrode disposed below the first substrate, a second electrode disposed on the second substrate and corresponding to the first electrode, and an insulating paste coating disposed on a contact surface between the first electrode and the second electrode, the insulating paste coating being electrically connected with the first electrode and the corresponding second electrode. The invention has good universality, such that the requirements of implementing or applying the art on a ceramic circuit board, a metal-based circuit board, an epoxy glass fiber circuit board, a flexible printed circuit board and a glass circuit board can be set, and an electronic circuit board without a packaging element on the circuit boards above can also be manufactured.