Insulating Plate Housing for Electronic Device ESD Protection

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Solution Overview

Problem

Housings for electronic device units with divided cases face challenges in preventing electrostatic discharge due to gaps between cases, leading to increased assembly complexity, costs, and limitations in component arrangement and recycling, as existing solutions like insulating sheets or avoiding components beneath the gap are inefficient.

Innovation Solution

A housing design featuring insulating plates that extend from the opening edge of one case to the other, overlapping with the inner wall and forming a predetermined creepage distance to prevent electrostatic discharge, eliminating the need for additional insulating sheets and allowing for component placement beneath the joined edge.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an insulating sheet is provided inside the housing to cover the butted portion, then insulation properties against static electricity are improved, but assembling processes are added, costs increase, and heights of electronic components are limited

Engineering Contradiction:
Improveinsulation properties against static electricityVSAvoidassembling processes and number of components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The insulating plate is integrated as part of the housing structure itself, merging the insulating function with the housing case. This eliminates the need for separate insulating sheets and reduces assembly complexity while maintaining electrostatic insulation properties through the built-in insulating plate extending from the first case to the second case.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If an insulating sheet is provided inside the housing, then insulation properties against static electricity are improved, but heights of electronic components are limited

Engineering Contradiction:
Improveinsulation properties against static electricityVSAvoidheights of electronic components
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

By integrating the insulating plate into the housing structure rather than placing it as a separate component inside the device, the solution eliminates space constraints on electronic component heights. The insulating function is achieved through the housing design itself, leaving the internal space fully available for components of any height.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If electronic components are not provided on a substrate immediately below the butted portion, then insulation properties against static electricity are improved, but mounting efficiency of electronic components is degraded

Engineering Contradiction:
Improveinsulation properties against static electricityVSAvoidmounting efficiency of electronic components
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The insulating plate is formed as an integral part of the housing structure, merging the protective insulating function with the case design. This allows electronic components to be mounted freely on the substrate without restrictions, as the insulating protection is provided by the housing itself rather than requiring component placement avoidance.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of manufacture

If the housing is formed by butting and joining two cases, then ease of manufacture and recycling are improved, but electrostatic discharge can affect electronic components from outside

Engineering Contradiction:
Improveease of separation for recyclingVSAvoidelectrostatic discharge from outside
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The insulating plate is integrated into the housing structure, combining the segmented case design with built-in electrostatic protection. The housing maintains its ease of separation into two cases for manufacturing and recycling, while the integrated insulating plate prevents electrostatic discharge from affecting electronic components through the joint portion.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS8908381B2Housing for electronic device unit
Publication Date: 2014.12.09 MITSUBISHI ELECTRIC CORP
  • US8908381B2 patent drawing
  • US8908381B2 patent drawing
  • US8908381B2 patent drawing

AI summary

A housing for an electronic device unit includes a first case and a second case that are formed in a shape of a box with one of respective surfaces thereof being opened and are formed to be a box body. The housing includes an insulating plate that extends from the opening part of the first case to a side of the second case and overlaps with a wall surface of the second case. An engaging convex part is formed on a surface where the insulating plate is overlapped and an engaging hole that engages with the engaging convex part to regulate separation of the first case and the second case is formed. The insulating plate is in a shape in which an edge of the insulating plate spreads with a predetermined width from an opening edge where the first case and the second case are butted and the engaging hole.