Power Module Insulating Plate Layout for Low-Height Cooling
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Solution Overview
Problem
Current power modules for electric vehicles and data centers face challenges such as high height and weight, inefficient space usage, limited heat dissipation, complex assembly, and low power density due to their sequential internal structure and mask-type housing insulation, which complicates cable and fiber connections and increases costs.
Innovation Solution
A power module design featuring a primary and secondary converting unit, transformer, and heat dissipating units arranged on either side of an insulating plate with a semi-conducting layer, allowing for compact, efficient assembly and heat dissipation, and utilizing liquid or air-cooling systems with a fan unit for improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the high voltage chamber and low voltage chamber are arranged in parallel with sequential internal structure, then electrical insulation is ensured, but the height of the power module increases and portability becomes difficult
Solution Approach 1:
The patent transitions from a sequential parallel arrangement (one after another in the same dimension) to a planar side-by-side arrangement. The first and second converting units are positioned adjacent to each other in a two-dimensional plane, with the insulating plate separating them laterally rather than vertically stacking chambers, thereby reducing height while maintaining insulation.
Solution Approach 2:
The power module is divided into distinct functional segments: a first converting unit segment and a second converting unit segment, separated by an insulating plate. This segmentation allows independent positioning of high-voltage and low-voltage components on opposite sides of the insulating barrier, enabling compact lateral arrangement instead of vertical stacking.
2Reliability
If mask-type housing insulation is used, then electrical insulation is achieved, but the size, weight, and cost of the module increase
Solution Approach 1:
The patent extracts the insulation function from the external housing structure and relocates it to an internal insulating plate positioned between the converting units. This internal insulating plate handles the electrical isolation task, allowing the housing to be simplified and reduced in size and weight while maintaining the required insulation performance.
Solution Approach 2:
An insulating plate is introduced as an intermediary component between the first and second converting units. This intermediate insulating structure provides the necessary electrical isolation without requiring extensive mask-type housing insulation, thereby reducing overall module size, weight, and manufacturing cost.
3Volume of moving object
If the high voltage chamber is arranged deeply to accommodate components, then component placement is possible, but cable and optical fiber connection becomes difficult
Solution Approach 1:
Instead of arranging components deeply along the vertical dimension, the patent positions the first and second converting units adjacently in a horizontal plane. This lateral arrangement brings connection ports to more accessible positions on the module's exterior surface, facilitating easier cable and optical fiber connections while still providing adequate internal volume.
4Ease of manufacture
If power devices are arranged unreasonably with oblique transformer layout, then component placement is achieved, but space is wasted and power density is low
Solution Approach 1:
The patent employs asymmetric arrangement of components within each converting unit, positioning the transformer and power devices in optimized non-uniform patterns. This asymmetric layout eliminates wasted space and improves power density while maintaining ease of assembly, contrasting with conventional symmetric or oblique arrangements.
Solution Approach 2:
The patent integrates the transformer and power devices into a unified converting unit structure, merging previously separate components into a compact assembled module. This consolidation eliminates gaps and improves space utilization, thereby increasing power density while simplifying the overall assembly process.
5Temperature
If a long total wind tunnel is used for heat dissipation, then heat removal path is established, but wind resistance is large and heat dissipation capability is limited
Solution Approach 1:
The patent reconfigures the heat dissipation wind tunnel from a long linear path to a compact three-dimensional flow pattern. By utilizing vertical and lateral airflow paths around the compact converting units, the system achieves effective heat removal with a shorter overall wind tunnel length and reduced wind resistance.
6Temperature
If the number of cooling fins is increased and scattered, then heat dissipation surface is increased, but assembly becomes complicated
Solution Approach 1:
The patent consolidates multiple scattered cooling fins into integrated heat dissipation structures that are combined with the housing or mounting brackets. This merging approach maintains the necessary heat dissipation surface area while reducing the number of separate components and simplifying the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances power density, simplifies assembly and fabrication, reduces weight and size, and improves heat dissipation capabilities while maintaining electrical safety and compatibility with both air-cooling and liquid-cooling systems, thus addressing market demands and competitiveness.
Implementation Method 1
an insulating plate comprising an insulating plate body and a semi-conducting layer disposed on a surface of the insulating plate body
Implementation Method 2
a first heat dissipating unit on which the primary unit and the first active device unit are disposed; a second heat dissipating unit on which the secondary unit and the second active device unit are disposed
Implementation Method 3
utilizing liquid or air-cooling systems with a fan unit for improved cooling efficiency
Data Source
AI summary
The invention discloses a power module and a power conversion device. The power module includes a primary converting unit including a first active device unit; a secondary converting unit including a second active device unit; a transformer including a primary unit connected to the primary converting unit and a secondary unit connected to the secondary converting unit; a first heat dissipating unit on which the primary unit and the first active device unit are disposed; a second heat dissipating unit on which the secondary unit and the second active device unit are disposed; and an insulating plate including an insulating plate body and a semi-conducting layer disposed on a surface of the insulating plate body.