Insulating Probe Surround for Semiconductor Evaluation

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Solution Overview

Problem

Existing methods for evaluating electrical characteristics of semiconductor devices with vertical structures face challenges in reducing partial discharges and preventing foreign substances or rubber marks during the evaluation process, which can lead to damage and failures in downstream processes.

Innovation Solution

An evaluation apparatus featuring an insulating plate with probes and an insulator that surrounds the probes, allowing for contact with the semiconductor device's termination region while minimizing the contact area to reduce partial discharges and foreign substance transfer, using a detachable design for easy replacement and shape adaptation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an insulating liquid is used to prevent electrical discharge, then partial discharges are reduced, but evaluation cost increases and evaluation time increases

Engineering Contradiction:

Improveprevention of partial dischargeVSAvoidevaluation time

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent extracts the essential function of the insulating liquid (preventing partial discharge) and implements it using a solid insulating member instead, eliminating the need for liquid handling and subsequent drying steps that increase evaluation time

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The insulating member is designed as a disposable or easily replaceable component that can be quickly changed between evaluations, eliminating time-consuming cleaning and drying processes required when using insulating liquids

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Reliability

If silicone rubber is pressed against the entire termination portion to prevent partial discharge, then electrical discharge is reduced, but foreign substances and rubber marks are transferred to the chip surface

Engineering Contradiction:

Improveprevention of partial dischargeVSAvoidforeign substance transfer

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The insulating member is designed with a localized contact structure that provides insulation only at critical points where partial discharge occurs, rather than pressing against the entire termination portion, thereby preventing foreign substance transfer to non-critical areas

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The insulating member is divided into multiple separate contact points or zones rather than a single large contact area, providing sufficient insulation while minimizing the total contact area and reducing foreign substance transfer

Inventive Principle:

Principle #1Segmentation

3Reliability

If an insulating member is pressed against the wafer to prevent partial discharge, then electrical discharge is reduced, but foreign substances and rubber marks are transferred to the wafer surface

Engineering Contradiction:

Improveprevention of partial dischargeVSAvoidforeign substance transfer

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The insulating member makes contact only at specific localized points on the wafer termination region where partial discharge is most likely to occur, rather than pressing against the entire surface, thereby minimizing foreign substance transfer while maintaining discharge prevention

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent applies partial action by providing insulation only at the critical regions where partial discharge occurs, rather than covering the entire termination portion, reducing the contact area and thus reducing foreign substance transfer

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces partial discharges and minimizes the transfer of foreign substances or rubber marks to the semiconductor device, ensuring reliable evaluation and preventing downstream process failures, while also being cost-effective and adaptable to various semiconductor device shapes.

Implementation Method 1

an insulating portion 40, 42, 44, 46... an insulator 7 formed by combining the insulating portions 40, 42, 44, and 46

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

a lower surface of the semiconductor device is fixed to the surface of a chuck stage in contact therewith by vacuum suction

Methodology Applied

Scientific EffectVacuum suction: Vacuum

Data Source

PatentUS10539607B2Evaluation apparatus including a plurality of insulating portions surrounding a probe and semiconductor device evaluation method based thereon

Publication Date: 2020.01.21 MITSUBISHI ELECTRIC CORP

AI summary

An evaluation apparatus includes an insulating plate, a plurality of probes fixed to the insulating plate, an insulating portion having a connection portion connected to the insulating plate in a detachable manner and a tip portion continuous with the connection portion, the tip portion being narrower than the connection portion, an insulator formed by combining the insulating portions to surround the plurality of probes in planar view, and an evaluation unit for passing currents through the plurality of probes to evaluate electrical characteristics of an object to be measured.