Resin composition, substrate-attached film, metal/resin laminated body and semiconductor device
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Solution Overview
Problem
Existing insulating adhesive layers for aluminum base substrate plates face challenges in maintaining low elasticity at low temperatures while ensuring heat resistance and adhesiveness, which can lead to solder cracks due to metal expansion and contraction.
Innovation Solution
A resin composition comprising a modified elastomer with an acid anhydride group, a solvent-soluble polyimide resin, and an epoxy resin, with an inorganic filler having a thermal conductivity of 10 W/m·K or more, which is formulated to have a specific content ratio to achieve low elasticity at low temperatures and maintain heat resistance and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the elastic modulus of the insulating layer is reduced to suppress solder cracks, then the adhesiveness and heat resistance may deteriorate
Solution Approach 1:
The patent uses a composite resin composition containing multiple components: a modified elastomer having an acid anhydride group (provides low-temperature elasticity), a solvent-soluble polyimide resin (provides heat resistance), and an epoxy resin (provides adhesiveness). This composite formulation allows the insulating layer to simultaneously achieve low elastic modulus at low temperatures for solder crack prevention while maintaining adequate adhesiveness and heat resistance through the synergistic effects of the different resin components.
2Temperature
If thermal conductivity is enhanced by adding filler, then the elasticity of the insulating layer may increase, causing solder cracks
Solution Approach 1:
The patent carefully controls the type and content of inorganic filler added to the resin composition. By selecting specific inorganic fillers and limiting their content to appropriate levels, the formulation enhances thermal conductivity for heat dissipation while preventing excessive increase in elastic modulus that would cause solder cracks. The modified elastomer component compensates for the stiffening effect of the filler, maintaining low-temperature flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively reduces the elastic modulus of the cured product at low temperatures, preventing solder cracks and enhancing heat dissipation and adhesion, making it suitable for aluminum base substrate plates in applications like automotive illumination.
Implementation Method 1
the (D) is preferably a thermally conductive filler having a coefficient of thermal conductivity of 10 W/m·K or more
Implementation Method 2
a method of reducing the elasticity of the insulating layer such that the influence on solder by metal expansion and contraction is mitigated by the insulating layer
Implementation Method 3
adhesiveness to a metal member are also understandably important for an insulating layer used to a substrate plate
Data Source
AI summary
There is provided a resin composition which is suitable for an insulating adhesive layer to an aluminum base substrate plate. A cured product of this resin composition is low in elasticity in the low temperature region of 0°C or lower. In addition, this resin composition has both heat resistance and adhesiveness. This resin composition contains (A) a modified elastomer having an acid anhydride group, (B) a solvent-soluble polyimide resin, and (C) an epoxy resin.