Insulating Sheet with Boron Nitride Gradient for Thermal Conductivity and Adhesiveness
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Solution Overview
Problem
Conventional resin sheets containing boron nitride face challenges in enhancing both thermal conduction and adhesiveness while also preventing void generation at the interface with copper foils, leading to reduced insulation properties.
Innovation Solution
An insulating sheet with a thermosetting component and boron nitride is developed, featuring varying average major diameters of boron nitride across its thickness to enhance thermal conduction and adhesiveness, with specific diameter gradients and aspect ratios to minimize void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If boron nitride is used to enhance thermal conduction, then thermal conductivity is improved, but adhesiveness between the resin sheet and copper foil deteriorates
Solution Approach 1:
The patent applies local quality by creating different regions within the resin sheet with different boron nitride particle size characteristics. Specifically, the sheet has a first region with smaller average boron nitride particle size and a second region with larger average boron nitride particle size. This spatial variation in particle size allows different regions to optimize for different functions: one region for thermal conduction and another for adhesiveness, thereby resolving the contradiction between these two properties.
2Ease of manufacture
If conventional resin sheet structure is used, then manufacturing is simple, but voids are generated at the interface with copper foil
Solution Approach 1:
The patent implements local quality by defining specific regions within the resin sheet that have different boron nitride particle size distributions. The first region contains smaller boron nitride particles while the second region contains larger particles. This non-uniform structure is designed to prevent void formation at the copper foil interface while maintaining manufacturing feasibility, thus resolving the contradiction between manufacturing simplicity and reliability.
3Ease of manufacture
If uniform boron nitride distribution is used, then manufacturing is easy, but thermal conduction efficiency is reduced
Solution Approach 1:
The patent applies local quality by creating a non-uniform distribution of boron nitride particles throughout the resin sheet. Specifically, it defines a first region with a first average boron nitride particle size and a second region with a second average boron nitride particle size that is different from the first. This spatial variation in particle size optimizes thermal conduction efficiency by allowing larger particles to form better thermal pathways while smaller particles fill gaps and ensure complete coverage, thereby resolving the contradiction between manufacturing ease and thermal conduction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The insulating sheet effectively enhances thermal conduction and adhesiveness while suppressing void generation, thereby improving the thermal management and reliability of electronic components.
Implementation Method 1
hexagonal boron nitride has a property that the thermal conductivity in the plane direction is higher than the thermal conductivity in the thickness direction, and the thermal conductivity is anisotropic
Implementation Method 2
an insulating sheet containing a thermosetting component and boron nitride
Data Source
AI summary
Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing generation of voids. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average major diameter of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average major diameter of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.