Insulating Sheet Composition With Hollow Particles for Shape Conformability
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Solution Overview
Problem
There is a demand for a thermal insulation material with low elasticity and excellent elongation to accommodate various shapes, which existing thermal insulation materials fail to provide effectively.
Innovation Solution
A composition containing a specific compound with a polyoxyalkylene chain and (meth)acryloyl groups, combined with hollow particles, is used to create a thermal insulation material with low elasticity and excellent elongation, resulting in a sheet with enhanced conformability and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional thermal insulation materials are used, then thermal insulation performance is achieved, but elasticity is too high and elongation is insufficient for various shapes
Solution Approach 1:
The invention uses a composite binder system comprising both a polymerizable compound (acrylate or vinyl monomer) and a silicone resin. This composite approach allows the cured product to achieve both low elasticity and excellent elongation, enabling conformability to various shapes while maintaining adequate strength. The polymerizable compound provides structural integrity after curing, while the silicone resin contributes to flexibility and elongation properties.
Solution Approach 2:
The invention specifies precise parameter ranges for the binder components: the polymerizable compound at 1-50 wt% and silicone resin at 50-99 wt% of the total binder. By optimizing these parameter ranges, the cured product achieves the desired balance of low elasticity and excellent elongation, resolving the contradiction between shape adaptability and mechanical strength.
2Temperature
If hollow particles are added to enhance thermal insulation, then thermal insulation performance improves, but the material becomes more rigid and less adaptable
Solution Approach 1:
The invention incorporates hollow particles as porous fillers within the binder matrix. These hollow particles provide excellent thermal insulation by trapping air pockets, while the surrounding polymerizable compound and silicone resin binder system maintains flexibility and elongation. The binder fills the spaces between hollow particles and provides a flexible matrix that allows the material to conform to various shapes despite the presence of rigid hollow particles.
3Temperature
If the binder is made from silicone resin with T unit and D unit, then thermal insulation is improved, but elongation and adaptability to various shapes are insufficient
Solution Approach 1:
The invention enhances the conventional silicone resin binder by adding a polymerizable compound (acrylate or vinyl monomer) to create a composite binder system. The silicone resin provides thermal insulation and flexibility, while the polymerizable compound contributes to elongation and structural integrity. This composite approach resolves the insufficiency of elongation and shape adaptability in conventional silicone resin-based binders.
Solution Approach 2:
By adjusting the composition parameters of the binder system - specifically setting the polymerizable compound at 1-50 wt% and silicone resin at 50-99 wt% - the invention optimizes the balance between thermal insulation, elongation, and shape adaptability. This parameter optimization allows the material to overcome the limitations of conventional silicone resin binders.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a balance of low elasticity and high elongation, allowing for improved conformability and adhesiveness, making it suitable for diverse applications while maintaining effective thermal insulation properties.
Implementation Method 1
a composition containing a specific compound having a polyoxyalkylene chain and two (meth)acryloyl groups
Implementation Method 2
hollow particles having low thermal conductivity may be used in order to enhance the thermal insulation performance
Data Source
AI summary
A composition containing a compound represented by the following Formula (1):[in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain.]; and hollow particles.


