Insulating Substrate With Graphene Spreaders for Power Module Cooling

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Solution Overview

Problem

Existing insulating substrates in power modules face limitations in heat dissipation efficiency due to thermal expansion coefficient differences between metal and ceramic materials, and the low vertical thermal conductivity of graphite sheets used for heat dissipation.

Innovation Solution

Incorporating inner and outer thermal spreaders made of graphite in a graphene form into copper metal layers within the insulating substrates, disposed parallel to the surface and along the periphery of the semiconductor chip, to enhance heat dissipation paths while maintaining electrical signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If graphite sheets are used for heat dissipation in insulating substrates, then heat dissipation path is provided, but vertical thermal conductivity is low and heat dissipation efficiency is limited

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidvertical thermal conductivity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent combines copper metal layers with graphite thermal spreaders to create a composite insulating substrate structure. The copper layers provide high vertical thermal conductivity for efficient heat dissipation, while the graphite thermal spreaders are integrated within the copper layers to enhance lateral heat distribution. This composite approach resolves the contradiction by leveraging the complementary thermal properties of both materials.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The graphite thermal spreaders are selectively positioned at specific locations within the copper metal layers, particularly in regions requiring enhanced lateral heat distribution. This local integration allows the structure to maintain high vertical thermal conductivity through copper while providing targeted lateral heat spreading capability where needed, optimizing overall heat dissipation efficiency.

Inventive Principle:

Principle #3Local quality

2Reliability

If metal layers are used for electrical signal transmission, then electrical conductivity is maintained, but thermal expansion coefficient differences with ceramic materials cause reliability issues

Engineering Contradiction:

Improveelectrical signal transmissionVSAvoidthermal expansion coefficient difference

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent employs a composite structure combining metal layers with ceramic insulating layers. The metal layers provide excellent electrical conductivity for signal transmission, while the ceramic layers offer thermal insulation and mechanical support. This composite design addresses the thermal expansion coefficient difference by creating a multi-layer structure where each material performs its optimal function, reducing stress and improving reliability.

Inventive Principle:

Principle #40Composite materials

3Temperature

If inner thermal spreaders are inserted into inner metal layer, then lateral heat distribution is improved, but structural complexity increases

Engineering Contradiction:

Improveheat distributionVSAvoidsubstrate structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent integrates graphite thermal spreaders within the copper metal layers by forming grooves or cavities in the copper layers and inserting the graphite spreaders into these spaces. This nesting approach allows the thermal spreaders to be incorporated into the existing metal layer structure without significantly increasing overall device complexity, while still providing improved lateral heat distribution.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The graphite thermal spreaders are positioned at specific locations within the metal layers where lateral heat distribution is most needed, rather than uniformly distributing them throughout the entire structure. This selective placement optimizes heat distribution performance while minimizing the increase in structural complexity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat dissipation efficiency by leveraging the horizontal thermal conductivity of graphite, reducing maximum temperature and enhancing heat distribution, thus overcoming the limitations of previous designs.

Implementation Method 1

at least one inner thermal spreader is inserted into the inner metal layer... improves heat dissipation efficiency by leveraging the horizontal thermal conductivity of graphite

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

formed in a graphene to be disposed parallel to a surface facing the semiconductor chip... enhancing heat distribution

Methodology Applied

Scientific EffectThermal diffusion: Diffusion

Data Source

PatentUS12183654B2Insulating substrate and power module using the same

Publication Date: 2024.12.31 HYUNDAI MOTOR CO LTD

AI summary

An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal spreader of a plurality of inner thermal spreader is inserted into the inner metal layer.