Insulating Substrate Light Emitting Device Wiring Patterns
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Solution Overview
Problem
Existing light emitting devices face challenges in achieving sufficient electrical insulation and cost-effective manufacturing due to complex processes and insufficient insulation between metal substrates and wiring units, leading to limited applications and high production costs.
Innovation Solution
A light emitting device with a structure featuring an insulating substrate, linear wiring patterns, and light emitting elements mounted between these patterns, ensuring electrical insulation and using a sealing member with fluorescent materials to enhance color rendering and adjust chromaticity, while simplifying manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a metal plate with element storage units and a printed circuit board with wiring unit are disposed close to each other to reduce device size, then the device complexity is reduced, but sufficient electrical insulation cannot be achieved between the metal plate and wiring unit
Solution Approach 1:
An insulating substrate is introduced as an intermediary component between the light emitting elements and the wiring patterns. This insulating substrate provides sufficient electrical insulation while allowing the wiring patterns to be formed directly on it, eliminating the need for a separate printed circuit board and maintaining device compactness.
Solution Approach 2:
The insulating substrate integrates multiple functions: it serves as the base for mounting light emitting elements, provides electrical insulation, and acts as the substrate for forming wiring patterns. This merging of functions eliminates the need for separate printed circuit boards and metal plates, reducing device complexity while maintaining insulation.
2Reliability
If a printed circuit board with wiring unit is used to provide electrical insulation, then electrical insulation is achieved, but complicated manufacturing processes are required resulting in high production cost
Solution Approach 1:
The patent extracts the essential function of electrical insulation from the complex printed circuit board structure and implements it through a simpler insulating substrate with directly formed wiring patterns. This eliminates the need for laminating copper foils and complex PCB manufacturing processes.
Solution Approach 2:
The patent changes the manufacturing approach by forming wiring patterns directly on the insulating substrate through printing or other simple processes, rather than using the traditional PCB lamination process. This parameter change in the manufacturing method significantly simplifies production and reduces costs.
3Reliability
If wiring patterns are formed on a printed circuit board to connect light emitting elements, then electrical connection is achieved, but the manufacturing process becomes complicated and costly
Solution Approach 1:
The patent uses a simple insulating substrate with printed wiring patterns instead of expensive printed circuit boards. This approach uses cheaper materials and simpler manufacturing processes to achieve the same electrical connection function, significantly reducing production costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a light emitting device with improved electrical insulation, reduced manufacturing complexity, and enhanced color rendering properties, making it suitable for applications like liquid crystal displays and illumination sources with adjustable luminance and chromaticity.
Implementation Method 1
a sealing member for sealing the light emitting elements. The sealing member contains a fluorescent material
Data Source
AI summary
By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.