Insulating Substrate for Semiconductor Isolation
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Solution Overview
Problem
Semiconductor devices used in high voltage or current applications face challenges with poor isolation quality, which can lead to irreversible damage, particularly in current sensors like Hall effect sensors that require effective insulation from extreme electrostatic potentials and currents.
Innovation Solution
The use of an insulating substrate with a thermal expansion coefficient matching that of the semiconductor substrate, such as a glass substrate, is employed to enhance isolation. This substrate is attached to the semiconductor substrate, and an isolation layer is formed around the sidewalls to prevent shorting and damage during processing and operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor devices are used in high voltage or current applications, then the devices can operate in these environments, but the isolation quality is poor which can lead to irreversible damage
Solution Approach 1:
An insulating substrate is introduced as an intermediary layer between the semiconductor substrate and the high voltage/current environment. This mediator provides enhanced electrical isolation and protects the semiconductor device from harmful electrostatic potentials and currents, resolving the contradiction between maintaining device operation and preventing damage.
Solution Approach 2:
The device structure combines the semiconductor substrate with an insulating substrate to create a composite structure. This composite material approach integrates the functional properties of both materials - the semiconductor for device operation and the insulator for enhanced isolation and protection - thereby improving reliability in high voltage/current applications.
2Reliability
If an insulating substrate is attached to the semiconductor substrate to enhance isolation, then electrical isolation and protection improve, but the device structure becomes more complex
Solution Approach 1:
The insulating substrate serves multiple functions simultaneously: it provides electrical isolation, mechanical support, and thermal management. By making the substrate multi-functional, the patent improves reliability without proportionally increasing complexity, as a single component performs multiple protective and supportive roles.
Solution Approach 2:
The patent selects an insulating substrate with specific parameters - particularly a thermal expansion coefficient that matches the semiconductor substrate. This parameter matching ensures thermal compatibility during processing and operation, preventing stress and delamination, thereby improving isolation effectiveness without adding complex stress management structures.
3Reliability
If the semiconductor substrate is thinned to expose sidewalls for isolation layer formation, then isolation quality improves, but the mechanical strength of the substrate decreases
Solution Approach 1:
The insulating substrate is attached to the semiconductor substrate before thinning operations. This pre-attachment provides mechanical support and cushioning during the thinning process, preventing the semiconductor substrate from becoming too weak or fracturing. The insulating substrate acts as a reinforcing backbone that enables aggressive thinning while maintaining structural integrity.
Solution Approach 2:
The thinned semiconductor substrate is effectively nested within or supported by the thicker insulating substrate. This nested structure allows the semiconductor layer to be extremely thin for optimal isolation while the insulating substrate provides the necessary mechanical strength and structural support, resolving the contradiction between thinning for isolation and maintaining strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides superior electrical isolation and protects semiconductor components from high voltage and current sources, ensuring the integrity of sensitive devices like Hall effect sensors by maintaining effective insulation throughout the device's lifecycle.
Implementation Method 1
The semiconductor material of the semiconductor substrate has about the same thermal expansion coefficient as the insulating substrate
Data Source
AI summary
In one embodiment, a semiconductor device includes a glass substrate, a semiconductor substrate disposed on the glass substrate, and a magnetic sensor disposed within and/or over the semiconductor substrate.