Insulating Substrate with Thermally Conductive Material for Power Electronics
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Solution Overview
Problem
Current electronic device assembly methods face challenges in effectively integrating electrically conductive and insulating components while ensuring thermal conductivity and electrical insulation, particularly in devices with semiconductor chips and complex circuit configurations.
Innovation Solution
The method involves using an electrically insulating substrate with a thermally conductive material, combined with conductive and insulating layers, to create a structured assembly that separates components electrically while allowing thermal dissipation, using techniques like physical vapor deposition and lamination to achieve efficient heat management and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrically conductive and insulating components are integrated in electronic devices, then electrical connectivity and insulation are achieved, but thermal management becomes difficult
Solution Approach 1:
The device is divided into separate functional layers: an electrically insulating substrate provides electrical isolation, while a thermally conductive electrically insulating material bonded to it provides thermal management. This segmentation allows independent optimization of electrical insulation and thermal dissipation pathways.
Solution Approach 2:
A thermally conductive electrically insulating material is introduced as an intermediary between heat-generating components and the heat sink. This intermediary material conducts heat away from components while maintaining electrical insulation, resolving the conflict between thermal management and electrical isolation requirements.
2Adaptability or versatility
If semiconductor chips with vertical structures and complex circuits are integrated, then device functionality is enhanced, but assembly complexity increases
Solution Approach 1:
The electrically insulating substrate and thermally conductive material are prepared and bonded together before component assembly. This preliminary preparation creates a pre-assembled thermal management structure that simplifies subsequent integration of semiconductor chips and other components.
Solution Approach 2:
The electrically insulating substrate serves multiple functions: providing mechanical support, ensuring electrical insulation, and facilitating thermal management when combined with the thermally conductive material. This multi-functionality reduces the need for separate components and simplifies overall device assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of robust electronic devices with improved thermal management and electrical insulation, allowing for the integration of semiconductor chips with vertical structures and complex circuits, enhancing the devices' performance and reliability.
Implementation Method 1
an electrically insulating substrate with a thermally conductive material
Implementation Method 2
using techniques like physical vapor deposition and lamination to achieve efficient heat management and electrical connectivity
Implementation Method 3
using techniques like physical vapor deposition and lamination to achieve efficient heat management and electrical connectivity
Data Source
AI summary
An electronic device and method is disclosed. In one embodiment, a method includes providing an electrically insulating substrate. A first electrically conductive layer is applied over the electrically insulating substrate. A first semiconductor chip is placed over the first electrically conductive layer. The first semiconductor chip comprises a first electrode on a first main surface and a second electrode on a second main surface. An electrically insulating layer is applied over the first electrically conductive layer. A second electrically conductive layer is applied over the electrically insulating layer. A through connection is provided in the electrically insulating layer to couple the first electrically conductive layer to the second electrically conductive layer.