Insulating Transformer With Glass Spacer Layer

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Solution Overview

Problem

Conventional insulating transformers face challenges in maintaining electrical insulation and reliability, especially in high-temperature environments and high-voltage applications, due to limitations in electrostatic discharge (ESD) tolerance and noise interference from external magnetic flux, which affects the longevity and performance of automotive and industrial equipment.

Innovation Solution

The design incorporates a semiconductor substrate with primary and secondary windings positioned on insulating substrates, separated by an organic insulating spacer layer, enabling miniaturization and securing an ESD tolerance voltage of 15 to 30 kV while maintaining electrical insulation between the low-voltage and high-voltage sides, thus alleviating noise interference and enhancing environmental tolerance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional insulating transformers are used with traditional insulation methods, then electrical insulation is maintained, but ESD tolerance voltage is insufficient and noise interference from external magnetic flux occurs

Engineering Contradiction:
ImproveESD tolerance voltageVSAvoidnoise interference from external magnetic flux
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs a composite insulation structure combining glass substrate insulation layers with resin encapsulation. The glass substrate provides high ESD tolerance voltage (15-30 kV) while the resin encapsulation seals the transformer, preventing noise interference from external magnetic flux. This composite approach resolves the contradiction by integrating materials with complementary properties.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The glass substrate acts as an intermediary insulating layer between the primary and secondary windings. This intermediate glass insulation layer blocks both electrical discharge (providing ESD tolerance) and magnetic flux penetration (reducing noise interference), effectively mediating between the electrical and magnetic fields while maintaining isolation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If the transformer size is reduced for miniaturization, then device footprint is decreased, but maintaining constant interval between windings for insulation becomes difficult

Engineering Contradiction:
Improvetransformer volumeVSAvoidelectrical insulation reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent uses thin glass substrate films as insulating layers between the windings. These thin glass films provide sufficient electrical insulation and ESD tolerance while occupying minimal space. The resin encapsulation then seals the entire structure, maintaining the constant interval between windings throughout the compact transformer volume, thus achieving miniaturization without compromising insulation reliability.

Inventive Principle:
Principle #30Flexible shells and thin films

3Reliability

If glass substrate is used for insulation of primary and secondary windings, then ESD tolerance voltage increases to 15-30 kV, but manufacturing complexity increases

Engineering Contradiction:
ImproveESD tolerance voltageVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The manufacturing process is segmented into distinct stages: first forming the primary winding on a glass substrate, then creating the secondary winding on a separate glass substrate, and finally bonding them together with resin encapsulation. This segmentation allows each component to be manufactured and inspected independently, reducing overall manufacturing complexity despite the high ESD tolerance requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The glass substrate serves multiple functions simultaneously: it provides structural support for the windings, acts as the primary insulating barrier, and contributes to the ESD tolerance voltage (15-30 kV). This multi-functionality reduces the need for additional separate insulating components, thereby simplifying the manufacturing process while maintaining high reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures reliable signal exchange with improved ESD tolerance and reduced noise interference, allowing for continuous operation in demanding environments without the need for photocouplers, thereby enhancing the reliability and longevity of power conversion devices.

Implementation Method 1

an insulating spacer layer, which insulates and separates the primary windings and secondary windings so as to maintain a constant interval between the semiconductor substrate and the insulating substrate

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

an insulating transformer, in which primary windings and secondary windings are positioned in mutual opposition, and the primary windings and secondary windings are insulated and separated by an insulating layer in film form

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS7994890B2Insulating transformer and power conversion device
Publication Date: 2011.08.09 FUJI ELECTRIC CO LTD
  • US7994890B2 patent drawing
  • US7994890B2 patent drawing
  • US7994890B2 patent drawing

AI summary

An insulating transformer includes a semiconductor substrate, an insulating substrate, a primary winding provided on one of the semiconductor substrate and the insulating substrate, a secondary winding provided on other of the semiconductor substrate and the insulating substrate, and an insulating spacer layer provided in between the semiconductor substrate and the insulating substrate for insulating and separating the primary winding and the secondary winding. The primary winding and the secondary winding are disposed to face each other. The insulating spacer layer maintains a constant interval between the semiconductor substrate and the insulating substrate.