Insulating Transformer Layout for Parasitic Noise Suppression
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Solution Overview
Problem
Existing gate driver technologies face issues with signal noise and erroneous operations due to parasitic capacitors between transformer coils, leading to impaired high-speed signal transmission and increased manufacturing costs due to different circuit configurations for low-voltage and high-voltage circuits.
Innovation Solution
Incorporating capacitors between the transformer coils and using a transformer chip with capacitors and dummy patterns to reduce signal interference and electric field concentration, allowing for shared transformer chip design across different voltage circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transformer is used for insulation between low-voltage and high-voltage circuits, then signal transmission is achieved, but parasitic capacitors between coils cause signal noise and erroneous operations
Solution Approach 1:
The patent extracts and removes the parasitic capacitor elements from the transformer structure by optimizing the coil winding configuration and insulation design, thereby eliminating the source of signal noise while maintaining the transformer's insulation function between low-voltage and high-voltage circuits
Solution Approach 2:
The patent introduces an intermediary shielding structure between the primary and secondary coils of the transformer, which acts as a mediator to block parasitic capacitor formation and prevent signal noise transmission while allowing the transformer to maintain its voltage isolation function
2Adaptability or versatility
If different circuit configurations are used for low-voltage and high-voltage circuits, then circuit functionality is achieved, but manufacturing costs increase
Solution Approach 1:
The patent designs a universal transformer chip structure that can serve both low-voltage and high-voltage circuit applications through a single standardized design, eliminating the need for separate circuit configurations and reducing manufacturing complexity and costs
Solution Approach 2:
The patent segments the transformer chip into modular components with standardized interfaces that can be configured for different voltage levels through simple assembly variations, allowing a single base design to serve multiple voltage circuit requirements without requiring completely different circuit configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces signal interference, enhances high-speed signal transmission, and lowers manufacturing costs by enabling a single transformer chip to serve both low-voltage and high-voltage circuits, improving the reliability and efficiency of the gate driver.
Implementation Method 1
a transformer that transmits a signal from the low-voltage circuit to the high-voltage circuit
Implementation Method 2
Incorporating capacitors between the transformer coils and using a transformer chip with capacitors and dummy patterns to reduce signal interference and electric field concentration
Data Source
AI summary
An insulating transformer includes an insulation layer, a transformer embedded in the insulation layer, and a capacitor. The transformer includes first and second coils. The first coil includes a first signal terminal and a first ground terminal. The second coil is separated from the first coil in a thickness direction of the insulation layer and includes a second signal terminal and a second ground terminal. The capacitor includes first and second capacitor electrodes. The first capacitor electrode is connected to the first ground terminal of the first coil. The second capacitor electrode is located between the first capacitor electrode and the second coil and connected to the second ground terminal of the second coil. The insulating transformer further includes a first insulation film located between the first coil and the first capacitor electrode, and a second insulation film located between the second coil and the second capacitor electrode.