Insulating Trench IC for Wireless Powering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing embedded electronic monitoring systems in load-bearing structures face reliability issues due to vulnerability from mechanical stress and corrosion, particularly in harsh environments like concrete structures, where electrical interconnections are prone to failure and power supply efficiency is compromised.
Innovation Solution
An integrated circuit (IC) design featuring a semiconductor substrate with circuitry, an interconnect layer, and electrically insulating trenches that reduce RF losses during wireless powering, combined with a seal ring and passivation layer to enhance durability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical interconnections are used in embedded monitoring systems, then the system can provide comprehensive monitoring functionality, but the reliability deteriorates due to vulnerability from mechanical stress and corrosion in harsh environments
Solution Approach 1:
The patent removes all electrical interconnections from the embedded monitoring system by extracting the antenna and circuitry from the traditional packaged configuration. The IC is designed to operate autonomously within the concrete structure without requiring external electrical connections, thereby eliminating the reliability issues associated with mechanical stress and corrosion of electrical interconnections.
Solution Approach 2:
The patent replaces the mechanical electrical interconnection system with a wireless electromagnetic communication system. The IC uses an integrated antenna to transmit and receive electromagnetic signals for power transfer and data communication, substituting the mechanical electrical connection paradigm with an electromagnetic field-based system that is immune to mechanical stress and corrosion.
2Reliability
If wireless powering is used to eliminate electrical interconnections, then reliability improves, but RF losses due to eddy currents increase power consumption
Solution Approach 1:
The patent segments the semiconductor substrate into isolated regions using insulating trenches. These trenches divide the continuous substrate into separate zones, preventing the formation of large-scale eddy current loops. By segmenting the substrate, the patent reduces the path length and area of eddy currents, thereby minimizing RF energy losses while maintaining wireless powering functionality.
Solution Approach 2:
The patent introduces a vertical dimension to the problem by etching insulating trenches into the substrate. This three-dimensional approach to electrical isolation allows the IC to maintain a planar surface configuration while implementing subsurface isolation structures that effectively block eddy current paths without interfering with the surface-mounted antenna and circuitry.
3Loss of energy
If the IC extends trenches outside the seal ring perimeter, then eddy current reduction is enhanced, but the manufacturing complexity increases
Solution Approach 1:
The patent performs the trench fabrication process before applying the seal ring and final packaging layers. By completing the insulating trench etching and filling operations early in the manufacturing sequence, the patent enables subsequent processes to proceed without interference, and the trenches extending beyond the seal ring perimeter can be established as part of the substrate preparation rather than as a post-processing modification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The IC design significantly reduces eddy currents and power losses, improving the reliability and longevity of embedded sensors by providing a more robust and efficient power supply mechanism in harsh environments.
Implementation Method 1
the at least one electrically insulating trench reducing RF losses due to eddy currents during wireless powering of the IC during use and during testing in a wafer form
Data Source
AI summary
A method of making an integrated circuit (IC) includes forming circuitry over a top surface of a semiconductor substrate having the top surface and an opposite bottom surface. An antenna is formed in an interconnect layer formed above the semiconductor substrate, where the antenna is coupled to circuitry. A seal ring is formed around a periphery of the interconnect layer. The seal ring is disposed around the antenna and the circuitry. A trench with a solid-state insulating material is formed. The trench extends vertically into the semiconductor substrate and extends laterally across the IC.