Insulation Base Connecting Structure with Laser-Processed Grooves
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Solution Overview
Problem
Traditional methods for connecting stacked circuit boards using hollowed plates with through holes are complex and costly, requiring drilling and electroplating processes.
Innovation Solution
A method involving a hollowed annular insulation base with step-shaped grooves laser processed and plated with metal pads and wiring, followed by a conductive ink layer and solder paste for connection, replacing the need for drilling and electroplating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional hollowed plate with through holes is used for connecting stacked circuit boards, then electrical connectivity is achieved, but manufacturing complexity and cost increase due to drilling and electroplating processes
Solution Approach 1:
The invention extracts and eliminates the drilling and electroplating processes from the traditional through-hole connecting structure. Instead of creating physical through-holes requiring metallization, the patent uses surface-mounted conductive pads and wiring layers on the insulation base to achieve electrical connectivity, thereby removing complex manufacturing steps while maintaining functional performance
Solution Approach 2:
The invention replaces the mechanical drilling and electroplating system with a planar circuit board technology system. Electrical connections are established through printed conductive patterns and surface-mount technology rather than physical through-holes, substituting mechanical manufacturing processes with electromagnetic field-based electrical connections
2Reliability
If traditional hollowed plate with through holes is used for connecting stacked circuit boards, then electrical connectivity is achieved, but manufacturing cost increases
Solution Approach 1:
The invention employs standard insulation base materials and conventional printed circuit board technologies that are inexpensive and widely available. The connecting structure uses cost-effective conductive ink layers and surface-mount components rather than expensive drilled and plated through-holes, reducing material and processing costs while achieving reliable electrical connections
Solution Approach 2:
The insulation base serves multiple functions simultaneously: it provides mechanical support for stacking circuit boards, establishes electrical connectivity through integrated conductive pads and wiring, and enables surface-mount component attachment. This multi-functionality eliminates the need for separate connection mechanisms, reducing overall manufacturing complexity and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process, reduces costs, and enhances bonding between circuit boards while maintaining effective electrical connectivity.
Implementation Method 1
a plurality of first grooves (14) are defined on a first surface (11) of the insulation base (10), a plurality of second grooves (15) are defined on a second surface (12) of the insulation base (10), and a plurality of third grooves (16) are defined on a lateral surface (13) of the insulation base (10). Each of the third grooves (16) connects one of the first grooves (14) and one of the second grooves (15)
Data Source
AI summary
A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.