Insulation Block Encloses Microsprings to Prevent Buckling
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Solution Overview
Problem
Conventional probe cards for testing semiconductor devices are prone to damage and susceptibility to short circuits and buckling, especially when the pitch between adjacent probe tips is reduced, leading to false positives and false negatives during operation.
Innovation Solution
A microspring probe card with an insulation block that encloses conductive microsprings, providing structural support and preventing short circuits, while the indented surface of the insulation block ensures reliable contact with semiconductor devices, reducing lateral motion and enhancing contact reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pitch between adjacent probe tips is reduced, then the productivity of semiconductor testing is improved, but the reliability of the probe card deteriorates due to increased susceptibility to short circuits and buckling
Solution Approach 1:
The probe card is divided into multiple independent probe tips arranged in a grid pattern, each capable of making contact with semiconductor devices independently. This segmentation allows for reduced pitch between tips while maintaining individual stability through the insulation block structure
Solution Approach 2:
An insulation block made of electrically insulating material is introduced as an intermediary component between adjacent conductive probe tips. This insulation block prevents short circuits between neighboring tips while providing mechanical support to reduce buckling, enabling reduced pitch without compromising reliability
2Device complexity
If conventional cantilevered pillar contact elements are used, then the device complexity is reduced, but the reliability deteriorates due to delicacy and proneness to damage
Solution Approach 1:
The probe tips are designed with a spring-like flexible structure rather than rigid cantilevered pillars. This flexibility allows the contact elements to withstand repeated contact cycles and resist damage while maintaining electrical connectivity, significantly improving durability without substantially increasing complexity
3Area of stationary object
If the pitch between probe tips is reduced, then the area of the probe card is reduced, but the reliability worsens due to increased susceptibility to short circuits
Solution Approach 1:
Electrically insulating material forming the insulation block is placed between adjacent conductive probe tips to prevent electrical short circuits. This intermediary insulation layer enables the use of reduced pitch between tips while maintaining electrical isolation, allowing smaller probe card area without sacrificing short circuit resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces the risk of short circuits and buckling, improving the reliability of the probe card and minimizing false positives and false negatives during semiconductor device testing.
Implementation Method 1
conductive microsprings... As the probe card is moved toward the semiconductor devices, the second ends of the conductive microsprings come into contact with contact pads
Data Source
AI summary
A probe card includes a conductive body, an insulation block, and a plurality of conductive microsprings. The insulation block covers at least one side of the body and at least partially encloses the microsprings. A first end of each microspring is connected to the conductive body and a second end is exposed from the insulation block. In operation, the probe card is moved onto one or more semiconductor devices to be tested. As the probe card is moved toward the semiconductor devices, the second ends of the conductive microsprings come into contact with contact pads on the semiconductor devices. The insulation block encloses the microsprings, which prevents the microsprings from buckling or making contact with each other. As a result, the probe card produces fewer false positives and false negatives during the testing process.