Insulation Chip Transformer Layout for High-Voltage Pulse Isolation
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Solution Overview
Problem
Existing signal transmission devices face challenges in efficiently insulating primary and secondary circuits while transmitting pulse signals, particularly in high-voltage applications, where existing solutions struggle to maintain effective insulation and dielectric strength without increasing the complexity or cost of the transformer design.
Innovation Solution
The signal transmission device employs a transformer chip with a series-connected first and second transformer configuration, where the first transformer includes a first coil closer to the primary circuit and a second coil closer to the secondary circuit, both electrically insulated and magnetically coupled, to transmit signals while maintaining high insulation voltage and dielectric strength, using a substrate with stacked element insulation layers and a substrate insulation layer to optimize the distance and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transformer is used to transmit signals between primary and secondary circuits, then signal transmission is enabled, but insulation between the circuits becomes challenging
Solution Approach 1:
The transformer is divided into two separate chips: a primary chip containing the primary coil and a secondary chip containing the secondary coil. These chips are bonded together with an insulation layer between them, segmenting the insulation function from the signal transmission function while maintaining effective electrical isolation between primary and secondary circuits
Solution Approach 2:
An insulation layer is introduced as an intermediary element between the primary and secondary coils. This insulation layer acts as a mediator that provides the necessary dielectric strength and electrical isolation, enabling reliable signal transmission while maintaining strict insulation between the two circuits
2Reliability
If insulation layer thickness is increased to maintain dielectric strength, then insulation performance improves, but device size and manufacturing cost increase
Solution Approach 1:
The patent employs composite material structures with multiple insulation layers of different materials (first insulation layer, second insulation layer, third insulation layer) with varying dielectric properties. This allows optimization of dielectric strength while minimizing the total thickness required, thereby maintaining high insulation performance without excessive device size or manufacturing cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively insulates primary and secondary circuits, enhancing dielectric strength and reducing manufacturing costs by optimizing the distance between coils and the thickness of insulation layers, thereby improving the overall performance and efficiency of signal transmission in high-voltage applications.
Implementation Method 1
a transformer configured to transmit a signal from a primary circuit to a secondary circuit, the transformer including a first coil and a second coil, the first coil and the second coil being electrically insulated from each other and magnetically coupled to each other
Data Source
AI summary
A transformer chip of this signal transmission device comprises a substrate, an element insulation layer, and a first transformer and a second transformer provided within the element insulation layer. The first transformer is provided with a first coil, and a second coil which is disposed facing the first coil in a z direction. The second transformer is provided with a first coil, and a second coil which is disposed facing the first coil in the z direction. The second coil of the first transformer and the second coil of the second transformer are electrically connected. The substrate includes a body part, and a substrate insulation layer formed on the surface of the body part. The element insulation layer is layered on the surface of the substrate insulation layer.