Insulation Circuit Board with Intermediate Ground Patterns
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Solution Overview
Problem
High-voltage insulation circuit boards used in power semiconductor devices and inverter modules face issues with dielectric breakdown due to electric field concentration at the end sections of wiring patterns, leading to partial discharging and reduced reliability, especially under high-density mounting conditions.
Innovation Solution
The introduction of an insulation circuit board design featuring wiring patterns with intermediate electric potential sections, arranged between adjacent wiring patterns with potential differences, using resistors to divide the potential and reduce electric field concentration, and incorporating specific resin materials and inorganic fillers for improved thermal and insulation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wiring patterns are closely formed to increase mounting density, then productivity and quantity of components increase, but electric field concentration occurs at end sections leading to partial discharging and reduced reliability
Solution Approach 1:
A ground wiring pattern is introduced as an intermediary between the positive and negative wiring patterns. This ground pattern acts as a mediator that divides the large potential difference into smaller steps, preventing direct electric field concentration between adjacent positive and negative patterns while maintaining close spacing for high mounting density
Solution Approach 2:
The potential difference between adjacent wiring patterns is segmented by introducing intermediate ground patterns. Instead of having direct adjacency between positive and negative patterns with large potential difference, the potential gradient is divided into multiple smaller steps through the ground pattern, reducing electric field concentration at each interface
2Ease of manufacture
If chemical etching is used to form wiring patterns for cost efficiency, then manufacturing cost decreases, but end sections become sharply pointed causing electric field concentration and partial discharging
Solution Approach 1:
The ground wiring pattern serves as a buffer zone between positive and negative patterns, reducing the electric field stress on the chemically etched pattern ends. This intermediary structure compensates for the sharp edges created by chemical etching by providing an additional insulation path and reducing the potential gradient at critical points
Solution Approach 2:
By introducing ground wiring patterns at intermediate positions, the patent creates equipotential regions that reduce the potential gradient across the insulation layer. The ground patterns establish intermediate potential levels, preventing the formation of high electric field zones that would occur with direct positive-negative pattern adjacency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces electric field concentration and enhances partial-discharge resistance, achieving high insulation reliability while maintaining low production costs, even in high-density wiring configurations.
Implementation Method 1
an inorganic filler is filled into the resin of the insulation layer 2 at a high density... improving the thermal conductivity of the insulation layer 2
Implementation Method 2
a dielectric breakdown occurs... if a high voltage associated with the realization of the recent high power is always applied to such an insulation circuit board
Data Source
AI summary
The invention relates to a high-voltage insulation circuit board which is used in an electric power apparatus such as an electric power converter or the like such as power semiconductor device, inverter module, or the like and provides an insulation circuit board in which electric field concentration at the end sections of a wiring pattern is reduced, partial discharging is suppressed, and a reliability is high. According to the invention, there is provided an insulation circuit board having: a metal base substrate; and wiring patterns which are formed onto at least one of the surfaces of the metal base substrate through an insulation layer, characterized in that between two adjacent wiring patterns in which an electric potential difference exists among the wiring patterns, at least one or more wiring patterns or conductors which are in contact with the insulation layer and have an electric potential in a range of the electric potential difference between the adjacent wiring patterns are arranged. According to the invention, the electric field concentration at the end sections of the wiring pattern to which a high voltage is applied is reduced and partial-discharge-resistant characteristics are improved.