Multi-layer Insulation Circuit for Hazardous Location Noise Immunity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Wireless field devices in hazardous locations face challenges in noise immunity due to external noise interference, particularly when using remote antennas, as existing methods for DC-insulating signal ground and frame ground require discrete elements like chip capacitors, leading to increased mounting complexity, thickness, and cost.
Innovation Solution
An insulation circuit is designed with patterns on multiple layers of a board, where RF signals are input and output on one layer and signal and frame grounds are connected on another, achieving DC insulation without discrete elements, thereby improving noise immunity while meeting safety and explosion-proofness standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete elements like chip capacitors are used for DC-insulating signal ground and frame ground, then intrinsic safety and explosion-proofness standards are satisfied, but mounting complexity increases and device thickness increases
Solution Approach 1:
The patent merges the DC insulation function with the ground connection structure by forming insulating films between ground patterns on different layers of the printed circuit board. This integration eliminates the need for separate discrete insulating elements like chip capacitors, thereby reducing mounting complexity while maintaining intrinsic safety and explosion-proofness standards.
Solution Approach 2:
The patent transitions from using discrete components mounted on the board surface to forming insulating structures within the multi-layer board itself. By utilizing the vertical dimension of the multi-layer board construction, the insulating films are embedded between ground patterns on different layers, eliminating the need for additional discrete insulating elements and reducing overall device thickness.
2Reliability
If discrete elements like chip capacitors are used for DC-insulating signal ground and frame ground, then intrinsic safety and explosion-proofness standards are satisfied, but device thickness increases
Solution Approach 1:
The patent utilizes the vertical dimension of multi-layer board construction to embed insulating films between ground patterns on different layers. This approach eliminates the need for discrete insulating elements that would increase device thickness, as the insulation is integrated within the board's layered structure itself.
Solution Approach 2:
The insulating function is merged with the ground connection structure by forming insulating films as part of the board's internal construction. This integration eliminates the need for separate discrete insulating elements, thereby reducing device thickness while maintaining intrinsic safety and explosion-proofness standards.
3Reliability
If discrete elements are used for DC-insulating, then insulation is achieved, but mounting area increases reducing high-density mounting capability
Solution Approach 1:
The patent moves the DC insulation function from the board surface to the internal layers by forming insulating films between ground patterns on different layers. This utilization of the vertical dimension eliminates the need for discrete insulating elements on the mounting surface, preserving high-density mounting capability.
Solution Approach 2:
The DC insulation function is merged with the ground connection structure formed on different layers of the board. This integration eliminates the need for separate discrete insulating elements that would occupy mounting area, thereby maintaining high-density mounting capability.
4Reliability
If thicker wiring patterns are used to achieve DC insulation with discrete elements, then insulation is achieved, but copper losses increase
Solution Approach 1:
The patent achieves DC insulation by utilizing the vertical separation between ground patterns on different layers with insulating films, rather than increasing the thickness of wiring patterns on the same layer. This approach maintains thin wiring patterns and minimizes copper losses.
Solution Approach 2:
The DC insulation function is merged with the multi-layer board structure, using insulating films between layers to provide insulation. This eliminates the need for thicker wiring patterns, thereby reducing copper losses while achieving the required DC insulation.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Disclosed is an insulation circuit comprising: a first pattern formed on a first layer of a substrate, that receives high-frequency signals; a second pattern formed on this first layer next to the first pattern and that outputs the high-frequency signals received by the first pattern; a third pattern formed on a second layer different from the first layer of the substrate and connected with a signal ground, in such a way that the first and second patterns respectively overlap in plan view; and a fourth pattern formed on the second layer next to the third pattern and connected with a frame ground, in such a way that the first and second patterns respectively overlap in plan view.