Insulation Device with Intermediate Conductive Zones for Breakdown Voltage

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Solution Overview

Problem

Existing electrical insulation devices have a low breakdown voltage and high thermal resistance, which limits their ability to handle high potential differences without damaging the substrate, and increasing substrate thickness to improve breakdown voltage increases thermal resistance, leading to overheating of electronic components.

Innovation Solution

The use of an electrical insulation device with a stack of insulating substrate layers and additional electrically conductive zones that reduce the electrostatic field at the peripheral edges of the conductive layers, allowing for a higher breakdown voltage without increasing substrate thickness, achieved by metallizing the insulating substrate with conductive materials like tungsten or molybdenum and arranging these zones to impose intermediate potentials between the main conductive layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the thickness of the insulating substrate is increased to obtain a higher breakdown voltage, then the breakdown voltage is improved, but the thermal resistance of the substrate increases

Engineering Contradiction:
Improvebreakdown voltageVSAvoidthermal resistance
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent introduces N electrically conductive zones (intermediary elements) between the first and second conductive layers. These zones are connected to intermediate potentials and serve as mediators to redistribute and reduce the electrostatic field intensity at the peripheral edges, thereby increasing breakdown voltage without requiring increased substrate thickness

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the electrical potential parameter by introducing intermediate potentials between the two main conductive layers. By connecting the conductive zones to these intermediate potentials, the electrostatic field distribution is modified, reducing field intensity at critical edges and improving breakdown voltage while maintaining original substrate dimensions

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the thickness of the insulating substrate is increased to obtain a higher breakdown voltage, then the breakdown voltage is improved, but the cooling of electronic components deteriorates

Engineering Contradiction:
Improvebreakdown voltageVSAvoidcooling efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The conductive zones act as intermediary elements that redistribute the electrostatic field without requiring increased substrate thickness. This maintains the original thermal conduction path and cooling efficiency while achieving higher breakdown voltage through electrical field management

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

By modifying the electrical potential distribution through intermediate conductive zones, the patent achieves higher breakdown voltage without changing the physical dimensions of the substrate, thereby preserving the original thermal management performance

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the breakdown voltage while maintaining the same substrate thickness, reducing thermal resistance and preventing overheating of electronic components by minimizing the electrostatic field at the peripheral edges, thus effectively insulating against higher potential differences.

Implementation Method 1

reduce the value of the electrostatic field at a point of the peripheral edge of the first outer layer

Methodology Applied
Scientific EffectElectrostatic field: Electric Field

Implementation Method 2

an insulating substrate comprising two planar surfaces parallel to each other

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentEP2525402B1Electrical insulation device with improved breakdown voltage
Publication Date: 2020.01.01 ALSTOM TRANSPORT TECH SAS
  • EP2525402B1 patent drawingFigure 1~2
  • EP2525402B1 patent drawingFigure 3~4
  • EP2525402B1 patent drawingFigure 5~6

AI summary

The device (16) has a planar electrically conductive outer layer (36) arranged on a planar surface (32) of an insulating substrate (30). A reducing unit (44) reduces a value of electrostatic field in a point of a peripheral edge (38) of the layer and includes an electrically conductive area (50) distinct from the layer and arranged in the substrate. The reducing unit reduces the value of the field in the point with respect to the value of the field in the point in absence of the area. The area possesses an electric potential whose value strictly ranges between electric potential values. An independent claim is also included for a power supply system for electronic components.