Insulation Film Adhesive Layer for Chip Package Substrate
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Solution Overview
Problem
The existing technologies for manufacturing semiconductor or optical device packages face issues with the separation of the molding part and the substrate due to low surface energy and poor adhesion of the insulation layer, leading to reliability and durability problems.
Innovation Solution
A method is introduced to form a lower adhesive layer on the insulation film, which includes laminating a prepreg and creating surface roughness, followed by forming via holes and a circuit pattern layer, to enhance the adhesion between the substrate and the molding resin, thereby improving the reliability and durability of the chip package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulation layer is used in chip package manufacturing, then electrical insulation and structural support are provided, but the low surface energy of the insulation layer causes poor adhesion with the molding part, leading to separation phenomena
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the insulation layer and the molding part. This adhesive layer has high surface energy and strong adhesion properties, serving as a mediator that bonds the insulation layer to the molding part, thereby preventing separation while maintaining the electrical insulation function of the insulation layer.
Solution Approach 2:
The surface energy parameter of the interface between the insulation layer and molding part is changed by applying an adhesive layer. The adhesive layer possesses different surface energy characteristics compared to the insulation layer, enabling strong adhesion to both the insulation layer and the molding part, thus resolving the adhesion problem caused by the low surface energy of the insulation layer.
2Adaptability or versatility
If polyimide film is used as insulation layer, then flexibility and electrical insulation are achieved, but the inherent low surface energy of polyimide exacerbates adhesion problems with molding resin
Solution Approach 1:
The adhesive layer acts as a mediator that compensates for the low surface energy of the polyimide film. It provides strong adhesion to both the polyimide insulation layer and the molding resin, enabling the use of flexible polyimide film without suffering from its inherent adhesion deficiencies.
3Reliability
If surface roughness is increased on the adhesive layer, then adhesion with molding resin is improved, but manufacturing complexity increases
Solution Approach 1:
The surface morphology parameter of the adhesive layer is modified by forming surface roughness. This increased surface roughness provides mechanical interlocking with the molding resin, significantly improving adhesion strength. The roughness can be achieved through various manufacturing techniques such as laser treatment, chemical etching, or mechanical abrasion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method increases the adhesion power between the insulation film and the molding resin, enhancing the reliability and durability of the chip package, while also achieving lightweight, small-sized, and thin-thickness products.
Implementation Method 1
forming a lower adhesive layer in a lower part of an insulation film to increase surface energy
Implementation Method 2
laminating a prepreg on the lower part of the insulation film
Data Source
AI summary
Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the insulation film to form a base material; forming via holes in the base material; and forming a circuit pattern layer on the upper adhesive layer, so it is effective to improve adhesion power between the molding resin and the insulation film at the time of manufacturing a chip package later.