Insulation Film Power Module With Shorter Thermal Path
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power modules suffer from poor heat dissipation due to a multi-layer structure with high thermal resistance, complex manufacturing processes, and high costs, which are exacerbated by the use of ceramic substrates that hinder effective thickness reduction and yield.
Innovation Solution
A power module using an electrical insulation film made of an elastic material, such as aluminum nitride oxide, is directly placed on a heat sink to replace the traditional ceramic substrate, integrating heat sink fins and a heat dissipation channel to reduce structural layers and enhance heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layer structure with ceramic substrate is used, then electrical insulation is achieved, but thermal resistance increases and heat dissipation deteriorates
Solution Approach 1:
The patent merges the electrical insulation function and heat dissipation function into a single integrated component by coating the ceramic substrate with a thermally conductive electrically insulating material. This combination allows the component to simultaneously provide electrical insulation while efficiently conducting heat away from the power device, resolving the contradiction between insulation and heat dissipation.
Solution Approach 2:
The patent uses a composite material structure consisting of a ceramic substrate base layer combined with a thermally conductive electrically insulating material coating. This composite approach leverages the electrical insulation properties of ceramic materials while adding enhanced thermal conduction capabilities through the specialized coating material, thereby achieving both electrical insulation and effective heat dissipation.
2Stability of the object's composition
If a multi-layer structure with ceramic substrate is used, then structural stability is maintained, but manufacturing complexity increases and cost rises
Solution Approach 1:
The patent combines multiple functions into fewer structural layers by integrating the thermally conductive electrically insulating material directly onto the ceramic substrate. This reduction in layer count simplifies the manufacturing process and reduces assembly steps while maintaining the structural stability provided by the ceramic substrate base.
3Temperature
If ceramic substrate thickness is reduced, then heat conduction path is shortened, but manufacturing yield decreases and cost increases
Solution Approach 1:
The patent changes the thermal conduction parameters by introducing a thermally conductive coating material with superior thermal conductivity properties. This allows the system to achieve effective heat conduction even with thinner substrate dimensions, as the coating material compensates for the reduced thickness while maintaining manufacturing feasibility and yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency, reduces thermal resistance, decreases the module's size and cost, and lowers oscillation peak voltage by shortening the thermal conduction path and reducing circuit stray inductance.
Implementation Method 1
The heat generated by the power devices passes through the ceramic substrate or other insulating heat dissipation materials and is conducted to the metal plate
Implementation Method 2
the metal plate is dissipated through air cooling or water cooling
Data Source
AI summary
A power module using electrical insulation film to conduct heat is provided. The power module comprises an electrical insulation film, a heat sink, at least one base metal layer, at least one first semiconductor device, and a sealant. The electrical insulation film is made of an elastic material, and the electrical insulation film is formed on an upper surface of the heat sink. The base metal layer is formed on an upper surface of the electrical insulation film. The first semiconductor device is disposed on the base metal layer. The sealant is disposed on the heat sink. The electrical insulation film is placed on the heat sink for replacing the traditional ceramic substrate, thereby reducing the number of structural layers in the power module.