Insulation Layer Groove Lines for Pad Crack Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electrode connection structures in flat display panels face issues with adhesion and structural reliability due to cracks caused during the bonding process, particularly when using anisotropic conductive films with soft substrates, which affect the electrical connection and durability of the panels.
Innovation Solution
An electrode connection structure featuring a substrate layer with pads covered by an insulation layer that includes holes and groove lines, enhancing adhesion and stress dispersion, thereby preventing cracks and improving flexible properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an anisotropic conductive film is used to connect pads to the driving device, then electrical connection is achieved, but cracks are caused in the pads during the bonding process
Solution Approach 1:
The insulation layer is designed with a porous structure containing multiple holes, which allows the layer to absorb and disperse bonding stress during the ACF bonding process. This porous structure prevents stress concentration that would otherwise cause pad cracks, while still maintaining the electrical insulation function and allowing conductive balls to pass through for electrical connection.
Solution Approach 2:
The patent employs a composite structure where the insulation layer combines insulating material with a porous network of holes and groove lines. This composite design provides both mechanical stress absorption capability and electrical insulation, while the conductive balls embedded in the ACF provide the electrical connection path through the insulating layer to the pads.
2Reliability
If the insulation layer is made solid without holes, then insulation performance is improved, but adhesion and stress resistance are reduced
Solution Approach 1:
The insulation layer incorporates a porous structure with multiple holes that extend through the layer. This porous design maintains electrical insulation performance while the hole walls provide increased surface area for adhesion to adjacent layers. The porous structure also allows stress to be distributed along the hole walls rather than concentrating in a solid block, improving overall layer stability.
Solution Approach 2:
The patent adds vertical dimensionality to the insulation layer by creating holes and groove lines that extend through the layer thickness. This three-dimensional structure provides multiple adhesion interfaces at different depths and allows stress to be distributed throughout the volume rather than confined to a two-dimensional plane, enhancing both adhesion and stress resistance.
Data Source
AI summary
An electrode connection structure includes a substrate layer, a plurality of pads on the substrate layer, and an insulation layer at least partially covering the substrate layer and the pads. The insulation layer includes a plurality of holes on the pads and at least one first groove line extending between the pads neighboring each other.