Insulation Layer Interruption Structure for Oxide Peeling Prevention
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Solution Overview
Problem
During the dicing process of semiconductor wafers, the insulation layer can become damaged, leading to oxide-peeling issues that result in defective power semiconductor dies, which are then discarded, reducing yield and increasing manufacturing costs.
Innovation Solution
Incorporating an interruption structure within the insulation layer that extends to the edge of the power semiconductor die and is partially maintained during dicing, this structure blocks the peeling off of the insulation layer, preventing damage and ensuring reliable separation of dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the insulation layer is exposed during dicing to enable separation, then the dicing process can be performed, but the insulation layer becomes damaged and peeling occurs
Solution Approach 1:
The insulation layer is segmented by creating an interruption structure (discontinuity) that divides the layer into separate sections. This segmentation allows the dicing process to proceed through the interruption structure without causing lateral peeling, as the discontinuity prevents the propagation of peeling forces across the entire insulation layer while still enabling effective die separation.
2Reliability
If the insulation layer is continuous to provide protection, then reliability is improved, but oxide-peeling occurs during dicing
Solution Approach 1:
The interruption structure converts the potential harm of a continuous insulation layer (which causes oxide-peeling during dicing) into a benefit by strategically creating a discontinuity. This discontinuity acts as a stress release point that prevents lateral peeling propagation, thereby protecting the insulation layer from damage while still allowing the dicing process to effectively separate the dies.
3Reliability
If the insulation layer is made robust to prevent damage, then reliability improves, but dicing separation becomes difficult
Solution Approach 1:
The interruption structure segments the insulation layer at a controlled location, creating a weak point that facilitates clean separation during dicing. This segmentation allows the insulation layer to maintain its protective function in most areas while providing a predetermined separation path that enables easy and clean die separation without compromising overall layer integrity.
Data Source
AI summary
A power semiconductor die has a semiconductor body, an insulation layer on the semiconductor body, a passivation structure arranged above the insulation layer so as to expose a first insulation layer subsection that extends to an edge of the power semiconductor die, and an interruption structure in the first insulation layer subsection.