Thermally Conductive Insulation Layer for Electronic Module Heat Dissipation
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Solution Overview
Problem
There is a need to reduce thermal resistance between a semiconductor die and heat dissipation means in electronic modules to enhance heat dissipation capability, as existing solutions do not effectively manage heat dissipation.
Innovation Solution
An electronic module design featuring a semiconductor package with a die pad, encapsulant, and an insulation layer that is both electrically insulating and thermally conducting, where a heatsink is disposed on or in the insulation layer to improve heat transfer, and optionally a second heatsink is added on top for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional insulation layer is used between the semiconductor die and heatsink, then electrical insulation is provided, but thermal resistance is high which reduces heat dissipation capability
Solution Approach 1:
The patent applies composite materials by using an insulation layer composed of thermally conductive filler particles (such as aluminum oxide, aluminum nitride, or boron nitride) dispersed in an insulating matrix material. This composite structure simultaneously provides electrical insulation through the matrix while achieving low thermal resistance through the thermally conductive filler network, directly resolving the contradiction between electrical insulation and heat dissipation capability
2Temperature
If the heatsink is placed directly on the semiconductor die, then thermal resistance is reduced, but electrical insulation is compromised
Solution Approach 1:
The patent uses an intermediary insulation layer that mediates between the semiconductor die and heatsink. This layer acts as a thermal bridge while maintaining electrical isolation, allowing heat to flow from the die through the insulation layer to the heatsink while preventing electrical short circuits. The intermediary layer thus enables both low thermal resistance and maintained electrical insulation
3Reliability
If a thick insulation layer is used to ensure electrical insulation, then electrical safety is improved, but thermal resistance increases reducing heat dissipation
Solution Approach 1:
The patent changes the physical and chemical parameters of the insulation layer by incorporating thermally conductive filler materials with high thermal conductivity values. By adjusting the filler concentration, particle size distribution, and matrix composition, the layer achieves adequate electrical insulation thickness while maintaining low thermal resistance, thus improving heat dissipation capability without compromising electrical safety
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance, improving the heat dissipation capability of electronic modules by utilizing an electrically insulating and thermally conducting insulation layer with a heatsink, allowing for more efficient heat transfer and management.
Implementation Method 1
an insulation layer disposed on at least a portion of the first main face of the encapsulant and on the first main face of the die pad, wherein the insulation layer is electrically insulating and thermally conducting
Data Source
AI summary
An electronic module includes a semiconductor package having a die pad, a semiconductor die, and an encapsulant. The encapsulant has a first main face and a second main face opposite to the first main face. The die pad has a first main face and a second main face opposite to the first main face. The semiconductor die is disposed on the second main face of the die pad. An insulation layer is disposed on at least a portion of the first main face of the encapsulant and on the first main face of the die pad. The insulation layer is electrically insulating and thermally conducting. A heatsink is disposed on or in the insulation layer.