Insulation Heat-Dissipation Pad With Pre-Bonded Adhesive Isolation
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Solution Overview
Problem
Electronic devices with heat-generating components require insulation and heat-dissipation solutions that prevent electrical conductivity while effectively dissipating heat, as metal components used for cooling often conduct electricity.
Innovation Solution
A thermally conductive insulation film with a pre-bonded thermosetting adhesive layer is used to isolate heat-generating components from metal components, utilizing a thermally conductive insulation film and a thermosetting adhesive layer to ensure insulation and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal components are used for heat dissipation, then heat dissipation performance is improved, but electrical conductivity increases causing insulation problems
Solution Approach 1:
The patent uses a composite structure consisting of a thermally conductive insulation film combined with a thermosetting adhesive layer. The insulation film provides both thermal conduction and electrical insulation properties, while the adhesive layer bonds the film to heat-generating components. This composite material approach resolves the contradiction by achieving heat dissipation without compromising insulation.
Solution Approach 2:
The patent applies different materials with specific properties to different layers: the insulation film has high thermal conductivity and electrical insulation properties, while the adhesive layer provides bonding strength. This local differentiation of material properties allows the system to simultaneously achieve heat dissipation and insulation functions.
2Ease of manufacture
If insulation film and adhesive layer are separately bonded, then manufacturing flexibility is improved, but bonding strength and thermal contact are reduced
Solution Approach 1:
The patent combines the insulation film and adhesive layer into a single integrated structure where the adhesive is pre-applied to the film. This merging ensures strong bonding between the insulation film and heat-generating components while maintaining the thermal conduction and insulation properties of the film.
Solution Approach 2:
The adhesive layer is pre-bonded to the insulation film during manufacturing, creating a ready-to-use composite structure. This preliminary action ensures proper bonding strength and thermal contact are achieved without requiring separate bonding steps during device assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat dissipation and insulation, maintaining component isolation and preventing electrical conduction, even under displacement, with improved bonding strength and thermal conductivity.
Implementation Method 1
the lower film surface of the thermally conductive insulation film is supported on the metal portion of the second component to conduct heat with the metal portion
Implementation Method 2
The thermosetting adhesive layer is pre-bonded to the thermally conductive insulation film, and the thermosetting adhesive layer is configured to bond to a heat generating portion of a first component
Data Source
AI summary
The present disclosure disclosed an insulation and heat-dissipation pad and an electronic device including same, the insulation and heat-dissipation pad comprises: a thermally conductive insulation film; and a thermosetting adhesive layer. The thermosetting adhesive layer is pre-bonded to the thermally conductive insulation film, and the thermosetting adhesive layer is configured to bond to a heat generating portion of a first component or a metal portion of a second component, so as to isolate the heat generating portion from the metal portion in an insulated manner.