Insulation Panel Fixing Agent with Pivoting Legs
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Solution Overview
Problem
Current methods for attaching insulation boards to substrates in thermal insulation systems are labor-intensive and time-consuming, requiring significant logistical effort and resulting in high costs, with adhesives taking a long time to harden and potentially causing undesirable interactions with substrates, leading to adhesion losses and stability issues.
Innovation Solution
A method using a fixing agent with pivoting legs to temporarily secure insulation panels until adhesive foam hardens, allowing for precise positioning and compensation for surface unevenness, and featuring a flexible material for enhanced pivotability and secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesives are used to bond insulation boards to substrates, then bonding strength is achieved, but curing time is excessively long (at least three days)
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by using polyurethane-based adhesives instead of conventional cement-based or organic adhesives. This parameter change results in significantly reduced curing time while maintaining bonding strength, allowing insulation boards to be bonded and subsequently processed much faster than with traditional adhesives.
Solution Approach 2:
The patent replaces the chemical curing mechanism of conventional adhesives with a two-component polyurethane system that involves mixing and chemical reaction. This substitution enables better control over the bonding process and reduces the waiting time before further processing can begin.
2Reliability
If cement-based adhesives are used to bond insulation boards, then initial bonding is achieved, but undesirable interactions occur with certain substrates causing adhesion loss
Solution Approach 1:
The patent changes the chemical parameters of the adhesive by using polyurethane-based formulations instead of cement-based adhesives. This parameter change eliminates the harmful alkaline reactions with sensitive substrates while maintaining effective bonding strength, thus preventing saponification and softening issues.
Solution Approach 2:
The polyurethane adhesive acts as an intermediary material that bonds insulation boards to substrates without causing harmful chemical interactions. It mediates between the insulation board and substrate, providing adhesion without the damaging effects of cement-based adhesives on certain substrate materials.
3Reliability
If adhesive is applied manually to insulation boards, then bonding is achieved, but labor costs and time consumption are high
Solution Approach 1:
The patent employs self-leveling properties of the adhesive foam that automatically distributes itself across the insulation board surface, reducing the need for manual spreading and application efforts. This self-service characteristic improves installation speed and reduces labor requirements while maintaining bonding effectiveness.
4Device complexity
If insulation boards are bonded immediately without positioning aids, then bonding process is simplified, but positioning precision is poor
Solution Approach 1:
The patent applies adhesive to the insulation board before bonding, allowing the adhesive to begin its setting process and provide initial grip. This preliminary action enables better positioning control during the bonding process while maintaining overall process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces logistical and time-related costs, enhances productivity, and ensures secure bonding without adhesion losses, improving the stability and insulating properties of thermal insulation composite systems.
Implementation Method 1
applying the adhesive to a surface (5, 6) of the insulation board (1, 2) to be bonded and/or to the substrate (9) to be bonded to the insulation board (1, 2)... curing the adhesive located between the insulation board (1, 2) and the substrate (9)
Data Source
Figure 1~2
Figure 3
Figure 4~5b
AI summary
The invention relates to a method for attaching at least one insulation board (1, 2) to a substrate (9), comprising the following steps: providing an adhesive foam (10), applying the adhesive foam to a surface (5, 6) of the insulation board (1, 2) to be bonded and/or to the substrate (9) to be bonded to the insulation board (1, 2), bringing the surface (5, 6) of the insulation board (1, 2) to be bonded into contact with the substrate (9), fixing the insulation board (1, 2) to be bonded to the substrate (9) by means of at least one fixing agent, wherein the fixing agent has two legs (11, 12), and for fixing the insulation board (1, 2) the first leg (11) is attached to the substrate (9), and the second leg (12) is attached to the insulation board (1, 2), curing the adhesive foam located between the insulation board (1, 2) and the substrate (9), wherein the legs (11/12) of the fixative are pivotable against each other.The invention further relates to an insulation system that can be obtained using the method according to the invention.