Insulation Resin Sheet for Power Chip Thermal Management

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional power semiconductor devices face a trade-off between heat dissipation and insulating properties, where reducing the thickness of resin for improved heat dissipation compromises insulating performance.

Innovation Solution

A method involving the use of an insulation resin sheet with high thermal conductivity, fixed to the back surfaces of frames seating power chips, which enhances both heat dissipation and insulating properties by direct contact between the resin sheet and the frames, while being molded with a resin-sealing metal mold and cap pins to secure the chips and resin.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the thickness of resin between the back surfaces of the frames seating the power chips and the back surface of the semiconductor device is reduced to improve heat dissipation, then heat dissipation property is improved, but insulating property deteriorates

Engineering Contradiction:

Improveheat dissipation propertyVSAvoidinsulating property

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies local quality by using different materials with different properties in different regions. Specifically, a resin sheet with high thermal conductivity is used in the region where heat dissipation is critical (between the frame back surface and semiconductor device back surface), while maintaining adequate insulation where needed. This allows the thin resin sheet to provide both thermal conduction and electrical insulation, resolving the contradiction between heat dissipation and insulating properties.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the parameter of thermal conductivity by selecting a resin sheet material with high thermal conductivity. This parameter change allows the resin sheet to effectively conduct heat even at reduced thickness, while still maintaining sufficient electrical insulation properties, thus resolving the trade-off between heat dissipation and insulation.

Inventive Principle:

Principle #35Parameter changes

2Loss of energy

If the thickness of resin is reduced to enhance heat dissipation efficiency, then thermal management is improved, but electrical insulation performance deteriorates

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidelectrical insulation performance

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The resin sheet is specifically positioned between the frame back surface and the semiconductor device back surface, where heat dissipation is most critical. The high thermal conductivity of this localized resin sheet material enables efficient heat transfer from the power chips through the frame to the device housing, while its insulating properties prevent electrical breakdown, thus simultaneously improving heat dissipation efficiency and maintaining electrical insulation performance.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs a composite approach by using a resin sheet that combines both thermal conduction and electrical insulation properties. This composite material特性 allows the thin resin sheet to serve dual functions: conducting heat away from the power chips efficiently while simultaneously providing electrical insulation between conductive parts, thereby resolving the contradiction between heat dissipation efficiency and electrical insulation performance.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively improves heat dissipation and maintains excellent insulating properties in semiconductor devices, achieving a balance between thermal management and electrical insulation.

Implementation Method 1

an insulation resin sheet having a high thermal conductivity fixed to the back surfaces of frames seating power chips in contact with the back surfaces of the frames

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin

Methodology Applied

Scientific EffectPolymerization curing: Photopolymerisation

Data Source

PatentUS7781262B2Method for producing semiconductor device and semiconductor device

Publication Date: 2010.08.24 MITSUBISHI ELECTRIC CORP

AI summary

The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold. The resin sheet may include a metal foil which is disposed to the second surface.