Insulation Resistance Layer Prevents Plating Spreading in Chip Inductors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Chip electronic components, such as thin film inductors, face issues with plating spreading during the formation of external electrodes, leading to defects and potential device breakage when exposed to overvoltages, particularly due to protruding magnetic metal particles and inadequate insulation.
Innovation Solution
The implementation of insulation resistance layers with second magnetic metal particles coated with an oxide on the surfaces of the magnetic body prevents plating spreading and enhances the surface withstand voltage, thereby protecting the device from overvoltage-induced degradation and breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plating is performed to form external electrodes, then electrical conductivity is improved, but plating spreading occurs on the magnetic body surface causing defects
Solution Approach 1:
The patent divides the magnetic body surface into distinct regions: an exposed magnetic body surface for plating attachment and an insulation resistance layer surface that prevents plating spreading. This segmentation allows the plating process to be confined to specific areas while maintaining electrical conductivity where needed.
Solution Approach 2:
The insulation resistance layer acts as an intermediary between the magnetic body and the plating process. It provides a non-conductive barrier that prevents plating from spreading onto areas where it should not deposit, while still allowing the external electrodes to be properly formed on the exposed magnetic body surface.
2Ease of manufacture
If the magnetic body surface is exposed, then external electrodes can be formed, but the surface withstand voltage is insufficient leading to device breakage under overvoltage
Solution Approach 1:
The patent applies different surface treatments to different regions: the exposed magnetic body surface maintains its magnetic properties for electrode formation, while the insulation resistance layer provides high insulation resistance and enhanced withstand voltage capability in areas where electrical isolation is needed.
Solution Approach 2:
The insulation resistance layer is formed as a composite structure containing magnetic particles and a resin matrix. This composite material provides both mechanical protection and electrical insulation properties, enhancing the surface withstand voltage while allowing proper external electrode formation.
3Manufacturing precision
If insulation resistance layer is added, then plating spreading is prevented and withstand voltage is enhanced, but device complexity increases
Solution Approach 1:
The insulation resistance layer serves multiple functions simultaneously: it prevents plating spreading, provides electrical insulation, enhances surface withstand voltage, and protects the magnetic body. This multi-functionality reduces the need for additional separate components or processes.
Solution Approach 2:
The patent combines the insulation function and the plating prevention function into a single insulation resistance layer. This merging of functions simplifies the overall structure compared to using separate insulation layers and plating barrier layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents plating spreading and maintains device integrity by ensuring high insulation resistance and surface withstand voltage, thus preventing degradation and breakage caused by overvoltages, such as electrostatic discharge.
Implementation Method 1
The insulation resistance layers include second magnetic metal particles each having a core and an oxide coating covering the core
Implementation Method 2
a magnetic body including first magnetic metal particles
Data Source
AI summary
A chip electronic component includes a magnetic body including first magnetic metal particles, internal coil portions embedded within the magnetic body, and insulation resistance layers disposed on upper and lower surfaces of the magnetic body and including second magnetic metal particles having an oxide coating.