Insulation Adhesive Sheet Structure for Power Module Heat Dissipation
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Solution Overview
Problem
Existing power modules face challenges in maintaining insulation reliability while enhancing heat dissipation due to gaps in insulation members leading to electric discharge paths and insufficient thermal conductivity.
Innovation Solution
A power module configuration using a highly-heat-dissipating insulation adhesive sheet made by impregnating a porous ceramic sintered body with resin, where gaps are filled under pressure during sealing to prevent electric discharge paths and improve thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a porous ceramic sintered body is used as an insulation member to decrease thermal resistance, then heat dissipation is improved, but gaps remain inside the board leading to electric discharge paths and decreased insulation reliability
Solution Approach 1:
The patent applies preliminary action by pre-forming the porous ceramic sintered body with a specific internal structure before final assembly. The sintered body is prepared with controlled porosity and density distribution, creating a green body or pre-sintered structure that maintains structural integrity while providing thermal conduction pathways. This preliminary preparation ensures that the insulation member can subsequently fill gaps and prevent electric discharge paths without compromising insulation reliability
Solution Approach 2:
The patent utilizes parameter changes by controlling the physical and chemical parameters of the ceramic sintered body during manufacturing. Key parameters include porosity (30-70%), density distribution, particle size distribution, and sintering temperature. By optimizing these parameters, the insulation member achieves a balance between thermal conduction (requiring denser regions) and gap-filling capability (requiring porous structures), thereby preventing electric discharge while maintaining heat dissipation performance
2Reliability
If the insulation member is made denser to improve insulation reliability, then electric discharge paths are prevented, but thermal conductivity decreases
Solution Approach 1:
The patent applies local quality by creating non-uniform density and porosity distributions within the ceramic sintered body. Different regions of the insulation member have different properties: regions closer to ceramic particles or heat-generating components have higher density for better thermal conduction, while other regions maintain appropriate porosity for gap-filling and insulation. This spatial variation in material properties allows simultaneous optimization of both thermal conductivity and insulation reliability
Solution Approach 2:
The patent employs composite materials by combining ceramic particles (such as aluminum nitride, silicon nitride, or aluminum oxide) with organic binders or resins in a sintered matrix. This composite structure provides multiple benefits: the ceramic particles offer high thermal conductivity pathways, the binder matrix provides structural integrity and gap-filling capability, and the controlled porosity prevents electric discharge. The synergistic combination of these materials resolves the contradiction between thermal performance and insulation reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution inhibits insulation reliability issues and enhances heat dissipation, ensuring effective thermal conductivity and reliable insulation.
Implementation Method 1
a heat spreader or the like having heat conducting property by means of a joining member, and the semiconductor element and the heat spreader are sealed
Implementation Method 2
the insulation member serves to insulate and separate the cooler and the semiconductor element from each other in a power module provided with the cooler
Data Source
AI summary
The power module includes: a heat spreader having a plate shape and having heat conducting property; a semiconductor element at least thermally connected to a one-side surface of the heat spreader; a highly-heat-dissipating insulation adhesive sheet having a plate shape and having a one-side surface thermally connected to an other-side surface of the heat spreader; a metal plate having a one-side surface thermally connected to an other-side surface of the highly-heat-dissipating insulation adhesive sheet; and a sealing resin member sealing the semiconductor element, the heat spreader, the highly-heat-dissipating insulation adhesive sheet, and the metal plate in a state where an other-side surface of the metal plate is exposed, wherein the highly-heat-dissipating insulation adhesive sheet is a complex obtained by impregnating, with a resin, a porous ceramic sintered body in which ceramic particles have a gap and have been integrally sintered.