Thermally Conductive Insulation Sheet With Dense Particle Packing
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Solution Overview
Problem
Conventional insulation sheets fail to achieve sufficiently high thermal conductivity in the in-plane direction, which is essential for effectively dissipating heat from heat-generating components in electronic devices.
Innovation Solution
The insulation sheet comprises 75 to 97% insulating particles, 3 to 25% binder resin, and 10% or less voids, with flat-shaped particles like boron nitride, and a thermoplastic aramid resin binder, optimized through a roll press treatment to enhance packing density and reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the content of insulating particles is increased to improve thermal conductivity, then thermal conductivity improves, but the sheet becomes difficult to manufacture and maintains poor structural integrity
Solution Approach 1:
The invention changes the particle content parameter to 75-97% by area, which is higher than conventional sheets but within a range that maintains manufacturability. This parameter optimization resolves the contradiction by achieving high thermal conductivity while preserving structural integrity and ease of manufacture.
Solution Approach 2:
The invention uses a composite structure of insulating particles embedded in a binder resin matrix. This composite approach allows the sheet to achieve high thermal conductivity through the particles while the resin provides structural integrity and manufacturability, resolving the contradiction between particle content and ease of manufacture.
2Temperature
If the content of insulating particles is increased to improve thermal conductivity, then thermal conductivity improves, but structural integrity deteriorates
Solution Approach 1:
The invention optimizes the particle content parameter to 75-97% by area, which is sufficiently high to achieve excellent thermal conductivity (30 W/(m·K) or more) while maintaining structural integrity. This parameter control resolves the contradiction between thermal conductivity and structural strength.
Solution Approach 2:
The binder resin acts as an intermediary material that fills the spaces between insulating particles and provides structural support. This intermediary approach allows the sheet to maintain high particle content for thermal conductivity while the resin ensures structural integrity, resolving the contradiction between these two properties.
3Temperature
If voids are reduced to improve thermal conductivity, then thermal conductivity improves, but manufacturing complexity increases
Solution Approach 1:
The invention controls the void content parameter to 10% by area or less, which is sufficiently low to achieve high thermal conductivity while maintaining simple manufacturing processes. This parameter optimization resolves the contradiction between reducing voids and maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high thermal conductivity in the in-plane direction while maintaining electrical insulation and mechanical strength, effectively mitigating local temperature rises in electronic devices.
Implementation Method 1
a thermal conductive member capable of heat conduction in a specific direction is required
Data Source
AI summary
An object of the present invention is to provide an insulation sheet having high thermal conductivity in the in-plane direction. The present invention provides an insulation sheet comprising insulating particles and a binder resin, wherein, for the entire cross-section of the sheet perpendicular to the in-plane direction, the insulation sheet contains 75 to 97% by area of the insulating particles, 3 to 25% by area of the binder resin, and 10% by area or less of the voids.