Insulative Heat Slug for Semiconductor Thermal Management

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Solution Overview

Problem

Metal heat slugs in semiconductor device assemblies can cause electrical shorts and limit thermal dissipation due to their conductive nature, which interferes with wire bonds and other components.

Innovation Solution

A thermally conductive and electrically insulative heat slug is used, disposed on conductive clips, allowing for increased exposure area and preventing electrical shorts, enabling dual-sided cooling and improved thermal dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal heat slug is used to conduct heat, then thermal dissipation capability is improved, but electrical shorts occur between the heat slug and semiconductor die

Engineering Contradiction:

Improvethermal dissipation capabilityVSAvoidelectrical short prevention

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent introduces an electrically insulative material as an intermediary between the heat slug and conductive elements. This intermediate layer thermally couples the heat slug to the semiconductor die while electrically isolating them, preventing electrical shorts while maintaining thermal dissipation capability

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat slug is constructed as a composite structure with a metal core for thermal conduction and an electrically insulative material layer for electrical isolation. This composite approach allows simultaneous achievement of high thermal dissipation and electrical short prevention

Inventive Principle:

Principle #40Composite materials

2Reliability

If the area of metal heat slug is limited to prevent electrical shorts, then electrical short prevention is improved, but thermal dissipation capability deteriorates

Engineering Contradiction:

Improveelectrical short preventionVSAvoidthermal dissipation capability

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The composite heat slug structure with electrically insulative material allows the heat slug area to be maximized for thermal dissipation without causing electrical shorts, as the insulative material layer prevents electrical contact while maintaining thermal coupling

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution prevents electrical shorts and enhances thermal dissipation by increasing the exposed area of the heat slug, reducing thermal resistance by up to 20% or more in semiconductor device assemblies.

Implementation Method 1

The heat slug can include a thermally conductive and electrically insulative material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The heat slug can include a thermally conductive and electrically insulative material

Methodology Applied

Scientific EffectElectrical insulation: Electrical Resistance

Data Source

PatentUS11004777B2Semiconductor device assemblies

Publication Date: 2021.05.11 SEMICON COMPONENTS IND LLC

AI summary

In one general aspect, an apparatus can include a leadframe including a plurality of leads configured to provide electrical connections for the apparatus. The apparatus can also include a semiconductor die disposed on the leadframe and a conductive clip electrically coupling the semiconductor die with the leadframe. The apparatus can further include a heat slug disposed on the conductive clip. The heat slug can include a thermally conductive and electrically insulative material.