Insulative Support for High-Speed Interconnection
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Solution Overview
Problem
High-frequency electrical signals in high-density interconnection systems experience significant dielectric loss due to interactions with dielectric materials, leading to signal attenuation and reduced performance.
Innovation Solution
The use of insulative supports with strategically positioned openings and pedestals to suspend signal conductors, reducing dielectric material near regions of high electric field intensity, and surrounding them with reference conductors to minimize dielectric loss while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric material is used to support signal conductors in high-density interconnection systems, then structural integrity and electrical insulation are provided, but dielectric loss increases significantly at high frequencies
Solution Approach 1:
The patent extracts removes portions of the dielectric material from regions of high electric field intensity around signal conductors. By taking out the dielectric material where it causes maximum loss (near the conductor surfaces), the patent reduces dielectric loss while maintaining structural support in less critical areas through remaining dielectric portions and alternative support structures.
Solution Approach 2:
The patent applies local quality by creating non-uniform dielectric distribution - full dielectric material in regions where mechanical support is needed but lower electric field intensity exists, and reduced/removed dielectric material in regions of high electric field intensity near conductor surfaces. This local differentiation optimizes both structural support and electrical performance.
2Productivity
If signal conductors are placed closer together to increase interconnection density, then more data can be transmitted between boards, but electrical interference and crosstalk between adjacent conductors increase
Solution Approach 1:
The patent introduces reference conductors (ground or power conductors) as intermediary elements positioned between adjacent signal conductors. These reference conductors act as shields that electrically isolate adjacent signal conductors, reducing crosstalk and interference while allowing high-density placement of signal conductors for increased data transmission capacity.
3Object-affected harmful factors
If shield members are added between signal conductors to reduce interference, then crosstalk is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the shielding function with the existing connector structure by integrating reference conductors into the same insulative support housing that holds the signal conductors. Rather than adding separate shield members, the reference conductors are combined with the support structure, reducing overall complexity while maintaining shielding effectiveness.
Solution Approach 2:
The reference conductors serve multiple functions simultaneously: they provide electrical shielding between signal conductors, serve as reference potentials for impedance control, and can be integrated with the insulative support structure. This multi-functionality reduces the need for separate dedicated shield components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces dielectric loss by up to 15% at 14 GHz and 20% at 24 GHz, improving signal integrity and reducing insertion loss, especially for low voltage differential signals.
Implementation Method 1
High-frequency electrical signals in high-density interconnection systems experience significant dielectric loss due to interactions with dielectric materials
Data Source
AI summary
An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.