High-Voltage Insulator Adhesive Bonding with Displacement Ring
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Solution Overview
Problem
The production of high-voltage insulators is complex due to the introduction of a hardening binder through channels, which can introduce air bubbles or water, reducing dielectric strength and requiring demanding adhesive bonds for long-term vacuum-tightness and chemical resistance.
Innovation Solution
A high-voltage insulator design featuring a metal armature with an annular groove and axially aligned flanks for adhesive bonding, where the supporting ring acts as a displacement body to press adhesive into the joint, ensuring a vacuum-tight and homogeneous adhesive layer without air bubbles, and venting openings remove excess adhesive and air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If binder is introduced through channels in metal cap, then adhesive bonding is achieved, but air bubbles or water penetrate into hollow space reducing dielectric strength
Solution Approach 1:
Instead of introducing adhesive from the outside through channels (conventional method), the invention introduces adhesive from the inside of the hollow space outward through opening elements. This inversion prevents air bubbles and water from contaminating the bonding process while ensuring complete filling of the adhesive-bonding joint.
Solution Approach 2:
The invention extracts and eliminates the channels from the metal cap design. By removing the channels that previously caused contamination issues, the design achieves adhesive bonding without the harmful side effects of air bubble and water penetration.
2Ease of manufacture
If channels are provided in metal cap for binder introduction, then adhesive bonding is enabled, but channels require closing with elastic compound adding complexity
Solution Approach 1:
The invention completely removes the channels from the metal cap design. By extracting the channel structure, the need for closing elements (elastic compounds) is eliminated, significantly simplifying the overall device complexity while maintaining adhesive bonding functionality.
3Strength
If adhesive bond extends from end face onto lateral surface, then bonding strength is improved, but joint becomes harder to fill uniformly without air bubbles
Solution Approach 1:
The invention inverts the adhesive introduction direction by placing opening elements on the inner surface of the hollow space. This allows adhesive to flow outward in a controlled manner, ensuring uniform distribution across the extended bonding area (end face and lateral surface) while naturally expelling air bubbles through the same opening elements.
Solution Approach 2:
The opening elements are pre-positioned on the inner surface before adhesive introduction. This preliminary arrangement creates predetermined flow paths that guide adhesive uniformly across the bonding joint, ensuring complete filling of both end face and lateral surface areas without trapping air bubbles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies production, achieves a high-quality adhesively bonded connection with low leakage rates, excellent dielectric behavior, and long-term stability, ensuring reliable operation under mechanical, electrical, thermal, and chemical loads for up to 20 years.
Implementation Method 1
the supporting ring acting as a displacement body presses adhesive that has been introduced into the groove before the joining into the adhesive-bonding joint
Implementation Method 2
the first sealing surface and the second sealing surface slide on one another to form a seal
Implementation Method 3
The insulating tube is adhesively bonded to the metal armature at an end formed as a supporting ring
Implementation Method 4
venting openings remove excess adhesive and air
Implementation Method 5
The high-voltage insulator forms an insulating clearance of a cooling element which transfers heat formed by current losses in the high-voltage conductor to the encapsulation
Implementation Method 6
A working medium located inside the cooling element, such as acetone or a hydrofluoric ether, serves for the heat transfer and thereby circulates as a vapor from the evaporator through the insulating tube to the condenser, in which the vapor condenses as a liquid while giving off heat
Implementation Method 7
the vapor condenses as a liquid while giving off heat
Data Source
AI summary
A high-voltage insulator includes a metal armature, an insulating tube joined to the metal armature, which is adhesively bonded to the metal armature at an end formed as a supporting ring, and an axially symmetrical adhesive-bonding joint disposed around the axis of the insulating tube. An annular grove, which is formed in the metal armature, is disposed around the axis of the insulating tube and receives an end portion of the supporting ring. Sealing surfaces are respectively formed in the groove and in the supporting ring. The sealing surfaces are arranged and formed in such a way that, when the insulating tube and the metal armature are joined, they slide on one another, thereby forming a seal, and the supporting ring acting as a displacement body presses adhesive that has been introduced into the groove before the joining into the adhesive-bonding joint.