Cationic Polymerized Insulator Layer for Transistor Gate Dielectric
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Solution Overview
Problem
Conventional organic insulators used in electronic circuits lack satisfactory physical properties for insulation and dielectric applications, particularly in transistor gate insulating films.
Innovation Solution
A composition comprising a first organic compound, a second organic compound, and a photocationic polymerization initiator, along with polyvinyl phenol, is applied to form a cationically polymerized insulator layer, which provides both excellent insulation and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional organic insulators are used in insulator layers, then the laminate can be formed at lower temperatures without vacuum processes, but the insulation and dielectric properties are insufficient
Solution Approach 1:
The patent uses a composite organic insulator system comprising multiple components: polyvinyl phenol (PVP) as the base polymer, epoxy group-containing compounds for crosslinking, and photopolymerization initiators. This composite approach combines the advantages of each component to achieve both excellent insulation/dielectric properties and ease of manufacturing through solution processing and UV curing.
Solution Approach 2:
The patent modifies the chemical structure and composition parameters of the organic insulator by incorporating epoxy groups and using photopolymerization initiators. These parameter changes enable the material to be cured UV-light, transforming it from a liquid solution to a solid crosslinked network, thereby achieving superior electrical properties while maintaining simple processing.
2Temperature
If photopolymerization is used to form the insulator layer, then the insulator can be formed in liquid phase at lower temperatures, but additional photopolymerization initiators and UV irradiation equipment are required
Solution Approach 1:
The patent replaces thermal curing mechanisms with photopolymerization. Instead of using high-temperature thermal fields to cure the insulator, the invention uses UV light fields to activate photopolymerization initiators, enabling low-temperature curing. This substitution of the curing mechanism allows formation at lower temperatures while the added equipment (UV source) is relatively simple compared to high-temperature vacuum systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of high-performance laminates and transistors with improved insulation and dielectric properties, enhancing the performance of electronic devices by using a curable composition that forms a stable and effective insulator layer.
Implementation Method 1
irradiating the coating film with light containing light having an absorption wavelength of the photocationic polymerization initiator contained in the coating film to form an insulator layer
Data Source
AI summary
Laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor using a composition having the following (a) to (c):(a) a first organic compound represented by Formula (1) below (R represents a hydrogen atom or a glycidyl group. A plurality of Rs may be identical to or different from each other, but each of at least two Rs is a glycidyl group),(b) a second organic compound represented by Formula (2) below, and(c) a photocationic polymerization initiator