Molded Insulator Substrate Recesses for Encapsulation Venting
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Solution Overview
Problem
The formation of voids during the encapsulation process of molded interconnect substrates (MIS) leads to increased thermal mechanical mismatch and interfacial stresses, reducing the reliability of encapsulated components due to trapped air and volatile gases, which can cause delamination and cracking under thermal cycling.
Innovation Solution
Incorporating recesses in the molded insulator carrier to facilitate venting and enhance adhesion between the encapsulation and the MIS, thereby reducing the risk of void formation and improving the mechanical and electrical interlocking strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation material is molded over the MIS and device, then the component is protected and sealed, but voids form due to trapped air and volatile gases, reducing reliability
Solution Approach 1:
Recesses are pre-formed in the MIS carrier before the encapsulation molding process. These recesses serve as predetermined venting pathways that allow air and volatile gases to escape during encapsulation, preventing void formation while maintaining component reliability
Solution Approach 2:
The recesses act as intermediary venting channels between the encapsulation material and the external environment. They provide a controlled pathway for gas evacuation, mediating between the sealing function of encapsulation and the need to prevent voids
2Reliability
If recesses are incorporated in the MIS carrier, then void formation is reduced and reliability is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The MIS carrier incorporates recesses that create a porous or cavitated structure in strategic locations. This porous design provides venting functionality while maintaining overall structural integrity, improving reliability without excessive complexity
3Strength
If recesses are formed in the first insulator, then adhesion and mechanical interlocking are enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The recesses incorporate curved or non-planar surfaces that enhance mechanical interlocking through geometric interfitting. The curved geometry provides tolerance compensation and reduces sensitivity to manufacturing variations, improving adhesion without excessive precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recesses effectively vent trapped air and volatile gases, enhancing the reliability of encapsulated components by reducing the risk of delamination and cracking, and improving the structural integrity and adhesion between the encapsulation and the MIS.
Implementation Method 1
Incorporating recesses in the molded insulator carrier to facilitate venting and enhance adhesion between the encapsulation and the MIS
Implementation Method 2
Incorporating recesses in the molded insulator carrier to facilitate venting and enhance adhesion between the encapsulation and the MIS
Data Source
AI summary
One embodiment is directed towards a molded insulator substrate. The molded insulator substrate includes a first insulator having a first surface and a second surface. A recess in said first surface of the first insulator is configured to facilitate venting of a second insulator over exposed regions of the first surface. A first conductive terminal is exposed through the first surface. A second conductive terminal is exposed through the second surface and electrically coupled to the first terminal.