Integral Antenna Module Packaging for Smaller, Lower-Cost RF Packages

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Solution Overview

Problem

Incorporating antennas with semiconductor devices in microelectronic device packages is challenging due to the high cost and substantial device area requirements of existing solutions, which often employ expensive printed circuit board substrates covered with mold compound.

Innovation Solution

A microelectronic device package design that includes a semiconductor device mounted to a package substrate, an antenna module coupled to the semiconductor device, and covered by mold compound, with the antenna module mounted on the substrate and separated by cutting through saw streets, using a multilayer package substrate with cost-effective antenna modules and conductive traces for routing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If expensive printed circuit board substrates are used to mount antennas, then antenna performance is improved, but manufacturing cost increases

Engineering Contradiction:

Improveantenna performanceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive high-performance PCB substrates with inexpensive low-performance substrates for antenna mounting. The low-performance substrate is sacrificial in nature - it provides sufficient mechanical support and electrical connection during operation but is not designed for long-term durability, thereby reducing manufacturing cost while maintaining adequate antenna performance.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent divides the substrate into two distinct functional regions: a high-performance substrate area for mounting the semiconductor device, and a low-performance substrate area for mounting the antenna module. This segmentation allows each region to be optimized independently - the antenna region uses cost-effective materials while the device region maintains high performance requirements.

Inventive Principle:

Principle #1Segmentation

2Reliability

If large area substrates are used to accommodate antennas, then antenna functionality is improved, but device area increases

Engineering Contradiction:

Improveantenna functionalityVSAvoiddevice area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from planar antenna designs to three-dimensional antenna structures that extend vertically from the substrate surface. By utilizing the vertical dimension, the antenna achieves sufficient radiation area and functionality without increasing the horizontal footprint of the device package.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent integrates the antenna module within the same package footprint as the semiconductor device by stacking components vertically. The antenna module is mounted on the low-performance substrate which is positioned adjacent to or beneath the semiconductor device, effectively nesting multiple functional elements within a compact three-dimensional space.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS20260040952A1Microelectronic device package with integral antenna module and semiconductor device

Publication Date: 2026.02.05 TEXAS INSTRUMENTS INC

AI summary

In a described example, an apparatus includes: a semiconductor device mounted to a device side surface of a package substrate, the package substrate having a board side surface opposite the device side surface; an antenna module mounted to the package substrate and coupled to the semiconductor device; and mold compound covering the semiconductor device and a portion of the package substrate.