Integral Electrical Gasket for EMI Shielding Cost Reduction
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Solution Overview
Problem
Existing electronic systems face challenges in effectively shielding against radio-frequency interference (RFI) and electromagnetic interference (EMI) due to the high cost associated with using high-temperature plastic materials for over-molding conductive gaskets on plastic shields, which are preferred over metallic shields for absorptive and conductive properties.
Innovation Solution
An electrical gasket with spring members is integrally molded onto the shield, eliminating the need for over-molding and allowing the use of low-temperature plastic materials, thereby reducing costs and ensuring mechanical and electrical contact for effective EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature plastic material is used for over-molding conductive gasket on plastic shield, then electrical seal and EMI shielding are achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines the shield and electrical gasket into a single integrated component. The conductive gasket features are molded directly onto the shield body as an integral part, eliminating the need for separate over-molding processes. This merging of functions allows the use of low-temperature plastic materials while maintaining electrical sealing effectiveness, thereby reducing manufacturing costs associated with high-temperature materials and complex multi-step processes.
2Reliability
If high-temperature plastic material is used for over-molding conductive gasket, then mechanical and electrical contact is ensured, but production complexity increases
Solution Approach 1:
The shield and gasket are merged into a single molded part with conductive features integrated directly on the shield surface. This eliminates the separate over-molding step, reducing production process complexity while ensuring reliable mechanical and electrical contact through the integral design.
Solution Approach 2:
The conductive gasket features are pre-formed as integral parts of the shield during the primary molding process. This preliminary formation of electrical contact features eliminates the need for subsequent over-molding operations, simplifying the production process while ensuring reliable contact.
3Object-affected harmful factors
If conductive material coating is applied to housing covers, then EMI shielding is achieved, but manufacturing cost increases
Solution Approach 1:
The patent integrates EMI shielding functionality into the plastic shield component itself through molded-in conductive features, rather than requiring separate conductive coatings on housing covers. This integration achieves effective EMI shielding while eliminating the cost and complexity of applying and curing conductive coatings on multiple surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integral electrical gasket provides a cost-effective solution for EMI shielding by eliminating the need for high-temperature plastics and ensuring reliable contact between components, enhancing the shielding effectiveness without increasing production costs.
Implementation Method 1
The electrical gasket also includes a plurality of spring members for engaging the other of the first and second components to make mechanical and electrical contact between the first and second components
Data Source
AI summary
An electrical gasket provides an electrical seal between first and second components in an electrical module. The electrical gasket includes an attachment portion for fixedly attaching the electrical gasket to one of the first and second components and a plurality of spring members for engaging the other of the first and second components to make mechanical and electrical contact between the first and second components such that the electrical seal is provided between the first and second electrical components. One of the components of the module can be an EMI shield or printed circuit board of the module, and another of the components can be the module housing.